LEXI-R422 - System integration manual
UBX-23007449 - R02
Handling and soldering
Page 90 of 108
C1-Public
3.3.5
Repeated reflow soldering
Repeated reflow soldering processes and soldering the module upside-down are not recommended.
Boards with components on both sides may require two reflow cycles. In this case, the module should
always be placed on the side of the board that is submitted into the last reflow cycle. The reason for
this (besides others) is the risk of the module falling off due to the significantly higher weight in
relation to other components.
☞
u-blox gives no warranty against damages to the LEXI-R422 modules caused by performing more
than a total of two reflow soldering processes (one reflow soldering process to mount the LEXI-
R422 module, plus one reflow soldering process to mount other parts).
3.3.6
Wave soldering
LEXI-R422 LGA modules must not be soldered with a wave soldering process.
Boards with combined through-hole technology (THT) components and surface-mount technology
(SMT) devices require wave soldering to solder the THT components. No more than one wave
soldering process is allowed for a board with a LEXI-R422 module already populated on it.
⚠
Performing a wave soldering process on the module can result in severe damage to the device!
☞
u-blox gives no warranty against damages to the LEXI-R422 modules caused by performing more
than a total of two soldering processes (one reflow soldering process to mount the LEXI-R422
module, plus one wave soldering process to mount other THT parts on the application board).
3.3.7
Hand soldering
Hand soldering is not recommended.
3.3.8
Rework
Rework is not recommended.
☞
Never attempt a rework on the module itself, e.g. replacing individual components. Such actions
immediately terminate the warranty.
3.3.9
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating
products.
These materials affect the HF properties of the cellular modules and it is important to prevent them
from flowing into the module.
The RF shields do not provide 100% protection for the module from coating liquids with low viscosity,
therefore care is required in applying the coating.
☞
Conformal coating of the module will void the warranty.
3.3.10
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to
qualify such processes in combination with the cellular modules before implementing this in
production.
☞
Casting will void the warranty.
