V02.00 | 2021/11
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5.4
Grounding the device
5.4.1
Equivalent wiring diagram and shielding concept
1 nF
2,2 MΩ
1 nF
2,2 MΩ
X1
C0
C1
C2
C3
P1
X2
C4
C5
C6
C7
P2
4 x 15 nF
Fig. 5: TBEN-L5-4RFID-8DXP-OPC-UA – equival-
ent wiring diagram and shielding concept
5.4.2
Shielding of the fieldbus and I/O level
The fieldbus and the I/O level of the modules can be grounded separately.
1
2
3
Fig. 6: Grounding clip (1), grounding ring (2) and metal screw (3)
The grounding ring (2) is the module grounding. The shielding of the I/O level is permanently
connected to the module grounding. The module grounding is only connected to the refer-
ence potential of the installation when the module is mounted.
I/O level shielding
In the case of direct mounting on a mounting plate, the module grounding is connected to the
reference potential of the system via the metal screw in the lower mounting hole (3). If module
grounding is not desired, the electrical connection to the reference potential must be interrup-
ted, e.g. by using a plastic screw.
Fieldbus level shielding
The grounding of the fieldbus level can either be connected directly via the grounding clip (1)
or connected and routed indirectly via an RC element to the module grounding. If the ground-
ing is to be routed via an RC element, the grounding clip must be removed.
In the delivery state, the grounding clip is mounted.