Preliminary User's Manual l TQMa65xx UM 0001 l © 2021, TQ-Systems GmbH
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4.4
Protection against external effects
As an embedded module, the TQMa65xx is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system.
4.5
Thermal management
To cool the TQMa65xx, in average approximately 6 watts must be dissipated.
The power dissipation originates primarily in the AM65xx, the buck regulators and the DDR4 SDRAM.
The power dissipation also depends on the software used and can vary according to the application.
See AM65xx Data Sheet (1) for further information.
Attention: Destruction or malfunction, TQMa65xx heat dissipation
The TQMa65xx belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA
package, thermal pad, heatsink) as well as the maximum pressure on the AM65xx must be taken into
consideration when connecting the heat sink.
The AM65xx is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMa65xx and thus malfunction, deterioration or destruction.
4.6
Structural requirements
The TQMa65xx is held in the mating connectors by the retention force of the pins (560). For high requirements with respect to
vibration and shock firmness, an additional fastening has to be provided in the final product to keep the TQMa65xx in its
position. This can be achieved with the combination of heat sink and mounting method. Since no heavy and large components
are used, there are no further requirements.
4.7
Notes of treatment
To avoid damage caused by mechanical stress, the TQMa65xx may only be extracted from the carrier board by using the
extraction tool MOZIa65 that can also be obtained separately.
Note: Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the TQMa65xx
for the extraction tool MOZIa65.
5.
SOFTWARE
The TQMa65xx is shipped with a preinstalled boot loader U-Boot and a BSP provided by TQ-Systems, which is tailored for the
MBa65xx. The boot loader U-Boot provides TQMa65xx-specific as well as board-specific settings, e.g.:
•
AM65xx configuration
•
SDRAM configuration and timing
•
eMMC configuration
•
Multiplexing
•
Clocks
•
Pin configuration
•
Driver strengths
These settings have to be adapted, in case another bootloader is used.
More information can be found in the
