TQ TQMa65 Series, User Manual

Page: 2 / 38

Preliminary User's Manual l TQMa65xx UM 0001 l © 2021, TQ-Systems GmbH Page i
TABLE OF CONTENTS
1.
ABOUT THIS MANUAL ...................................................................................................................................................................................... 1
1.1 Copyright and license expenses .................................................................................................................................................................. 1
1.2 Registered trademarks .................................................................................................................................................................................... 1
1.3 Disclaimer ............................................................................................................................................................................................................ 1
1.4 Imprint ................................................................................................................................................................................................................... 1
1.5 Tips on safety ...................................................................................................................................................................................................... 2
1.6 Symbols and typographic conventions .................................................................................................................................................... 2
1.7 Handling and ESD tips ..................................................................................................................................................................................... 2
1.8 Naming of signals.............................................................................................................................................................................................. 3
1.9 Further applicable documents / presumed knowledge ..................................................................................................................... 3
2. BRIEF DESCRIPTION .......................................................................................................................................................................................... 4
2.1 Block diagram AM65xx.................................................................................................................................................................................... 5
2.2 Key functions and characteristics ................................................................................................................................................................ 5
3. ELECTRONICS ...................................................................................................................................................................................................... 6
3.1 Interfaces to other systems and devices ................................................................................................................................................... 6
3.1.1 AM65xx pin multiplexing ............................................................................................................................................................................... 6
3.1.2 Pinout TQMa65xx .............................................................................................................................................................................................. 7
3.2 System components ..................................................................................................................................................................................... 12
3.2.1 AM65xx CPU ..................................................................................................................................................................................................... 12
3.2.1.1 Boot Mode ........................................................................................................................................................................................................ 12
3.2.1.2 MCU Boot Mode Selection .......................................................................................................................................................................... 13
3.2.1.3 Boot Mode pin mapping ............................................................................................................................................................................. 14
3.2.2 Memory .............................................................................................................................................................................................................. 16
3.2.2.1 DDR4 SDRAM ................................................................................................................................................................................................... 16
3.2.2.2 eMMC .................................................................................................................................................................................................................. 16
3.2.2.3 OSPI NOR flash ................................................................................................................................................................................................ 17
3.2.2.4 EEPROM ............................................................................................................................................................................................................. 17
3.2.2.5 EEPROM with temperature sensor ........................................................................................................................................................... 18
3.2.3 RTC ....................................................................................................................................................................................................................... 19
3.2.4 Secure Element ............................................................................................................................................................................................... 19
3.2.5 I
2
C devices ......................................................................................................................................................................................................... 20
3.2.6 Board Controller ............................................................................................................................................................................................. 20
3.2.7 Reset .................................................................................................................................................................................................................... 20
3.3 Power .................................................................................................................................................................................................................. 21
3.3.1 Power supply ................................................................................................................................................................................................... 21
3.3.2 TQMa65xx power-up sequencing ............................................................................................................................................................ 21
3.3.3 Power consumption ...................................................................................................................................................................................... 21
3.3.4 Power modes ................................................................................................................................................................................................... 21
4. MECHANICS ...................................................................................................................................................................................................... 22
4.1 Connectors ....................................................................................................................................................................................................... 22
4.2 Dimensions ....................................................................................................................................................................................................... 23
4.3 Component placement ................................................................................................................................................................................ 25
4.4 Protection against external effects .......................................................................................................................................................... 26
4.5 Thermal management .................................................................................................................................................................................. 26
4.6 Structural requirements ............................................................................................................................................................................... 26
4.7 Notes of treatment ........................................................................................................................................................................................ 26
5. SOFTWARE ........................................................................................................................................................................................................ 26
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ............................................................................................................ 27
6.1 EMC ..................................................................................................................................................................................................................... 27
6.2 ESD ....................................................................................................................................................................................................................... 27
6.3 Operational safety and personal security.............................................................................................................................................. 27
6.4 Shock and vibration ...................................................................................................................................................................................... 27
6.5 Climate and operational conditions ........................................................................................................................................................ 28
6.6 Reliability and service life ............................................................................................................................................................................ 28