Toptech MultiLoad II DIV-2, Installation Manual

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5
ATEX
AND
IECE
X
I
NSTALLATIONS
:
▲ This equipment is suitable for use in EX Zone 2 Group IIB Locations, OR non-hazardous
locations.
▲
WARNING: Do not open when an explosive atmosphere may be present.
▲
WARNING: Do not disconnect equipment unless power has been removed or the area is
known to be non-hazardous.
▲
WARNING: EXPLOSION HAZARD. The area must be known to be non-hazardous before
servicing/replacing the unit and before installing.
▲
CAUTION: Battery may explode if mistreated. DO NOT RECHARGE, DISASSEMBLE, OR
DISPOSE OF IN FIRE.
▲
CAUTION: Field wiring must have a temperature rating of 75 °C or greater.
▲ A battery is soldered to the processor board for retention of data, time, and date. This battery
should last more than ten years. Please return the board to Toptech Systems for battery
replacement.
This battery must be replaced with Matsushita Electric, Model BR2477A
only. Use of another battery may present a risk of fire or explosion.
▲ The installation of this product must be in conformity with IEC/EN 60079-14.
Electrostatic Discharge (ESD) Protection 1.3
The MultiLoad II/ RCU II contains electronic components and assemblies subject to damage by ESD.
The MultiLoad II/ RCU II was designed to protect against ESD while the unit is closed and in normal
operation. Proper handling procedures must be observed during the removal, installation, repair and
other handling of printed circuit board assemblies, electronic devices and components. This includes:
1)
Service to be performed by authorized personnel only.
2)
The person performing the service must be grounded by an ESD grounding strap and
connected to ground.
3)
While performing maintenance or repair, touch an unpainted metal of the MultiLoad II/ RCU
II surface prior to touching or handling any printed circuit boards or electronic components.
4)
Printed circuit board assemblies must be placed in and transported in conductive bags or
other conductive containers.
5)
Printed circuit boards must not be removed from the conductive container until time of use.
6)
All other “best” practices for protecting devices from ESD must be observed.