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7.5.2.2 I

2

C Update Sequence

shows that for a single update, the DACx300x require a start condition, a valid I

2

C address byte, a

command byte, and two data bytes.

Table 7-14. Update Sequence

MSB

....

LSB

ACK

MSB

...

LSB

ACK

MSB

...

LSB

ACK

MSB

...

LSB

ACK

Address (A) byte

Section 7.5.2.2.1

Command byte

Section 7.5.2.2.2

Data byte - MSDB

Data byte - LSDB

DB [31:24]

DB [23:16]

DB [15:8]

DB [7:0]

shows that after each byte is received, the DACx300x family acknowledges the byte by pulling the

SDA line low during the high period of a single clock pulse. These four bytes and acknowledge cycles make up
the 36 clock cycles required for a single update to occur. A valid I

2

C address byte selects the DACx300x.

1

7

8

9

1

2 - 8

9

S

or

Sr

SDA

SCL

MSB

Address

START or

REPEATED

START

condition

Recognize

START or

REPEATED

START

condition

R/W

ACK

Acknowledgement

signal from target

Generate ACKNOWLEDGE

signal

Sr

or

P

P

Sr

REPEATED

START or

STOP

condition

Recognize

STOP or

REPEATED

START

condition

ACK

Figure 7-21. I

2

C Bus Protocol

The command byte sets the operating mode of the selected DACx300x device. For a data update to occur
when the operating mode is selected by this byte, the DACx300x device must receive two data bytes: the most
significant data byte (MSDB) and least significant data byte (LSDB). The DACx300x device performs an update
on the falling edge of the acknowledge signal that follows the LSDB.

When using fast mode (clock = 400 kHz), the maximum DAC update rate is limited to 10 kSPS. Using fast mode
plus (clock = 1 MHz), the maximum DAC update rate is limited to 25 kSPS. When a stop condition is received,
the DACx300x device releases the I

2

C bus and awaits a new start condition.

DAC53001, DAC53002, DAC63001, DAC63002

SLASF48 – MAY 2022

50

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Summary of Contents for DAC 300 Series

Page 1: ...mily of ultra low power single channel and dual channel buffered voltage output and current output smart digital to analog converters DACs The DACx300x devices support Hi Z power down mode and Hi Z output during power off conditions The DAC outputs provide a force sense option for use as a programmable comparator and current sink The multifunction GPIO function generation and NVM enable these smar...

Page 2: ... Characteristics Current Output 19 6 19 Typical Characteristics Comparator 24 6 20 Typical Characteristics General 25 7 Detailed Description 26 7 1 Overview 26 7 2 Functional Block Diagram 26 7 3 Feature Description 27 7 4 Device Functional Modes 29 7 5 Programming 46 7 6 Register Map 54 8 Application and Implementation 72 8 1 Application Information 72 8 2 Typical Application 72 9 Power Supply Re...

Page 3: ... This pin can ramp up before VDD 8 SDA SCLK Input Output Bidirectional I2C serial data bus or SPI clock input This pin must be connected to the IO voltage using an external pullup resistor in the I2C mode This pin can ramp up before VDD 9 NC NC No connection Leave this pin unconnected 10 NC NC No connection Leave this pin unconnected 11 OUT1 NC Output NC DAC63002 and DAC53002 Analog output voltage...

Page 4: ... document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process 2 JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process 6 3 Recommended Operating Conditions over operating free air temperature range unless otherwise noted MIN NOM MAX UNIT VDD Positive supply voltage to ground AGND 1 7 5 5 V VREF External refer...

Page 5: ...4064d for 12 bit resolution 8d to 1016d for 10 bit resolution 0 0008 FSR C Full scale error 4 6 1 7 V VDD 2 7 V DAC at full scale 1 1 FSR 2 7 V VDD 5 5 V DAC at full scale 0 5 0 5 Full scale error temperature coefficient 4 DAC at full scale 0 0008 FSR C OUTPUT Output voltage Reference tied to VDD 0 VDD V CL Capacitive load 2 RL infinite phase margin 30 200 pF Phase margin 30 1000 Short circuit cur...

Page 6: ...5 5 V 0 9 Power supply rejection ratio ac 3 Internal VREF gain 4x 200 mV 50 Hz or 60 Hz sine wave superimposed on power supply voltage DAC at midscale 68 dB Code change glitch impulse 1 LSB change around midscale including feedthrough 10 nV s Code change glitch impulse magnitude 1 LSB change around midscale including feedthrough 15 mV POWER IDD Current flowing into VDD 4 5 Normal operation DACs at...

Page 7: ...Output compliance voltage 1 DAC output range 0 µA to 25 µA to VDD and to AGND 200 mV DAC output ranges 0 µA to 50 µA 0 µA to 125 µA and 0 µA to 250 µA to VDD 400 all unipolar negative ranges to VDD 400 DAC output ranges 25 µA 50 µA 125 µA and 250 µA to VDD and to AGND 400 ZO IOUT dc output impedance 2 DAC at midscale DAC output kept at VDD 2 60 MΩ Power supply rejection ratio dc DAC at midscale ou...

Page 8: ...tive load CL 200 pF to AGND digital inputs at VDD or AGND all minimum and maximum specifications at 40 C TA 125 C and typical specifications at TA 25 C unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC PERFORMANCE Offset error 1 2 1 7 V VDD 5 5 V DAC at midscale comparator input at Hi Z and DAC operating with external reference 5 0 5 mV Offset error time drift 1 VDD 5 5 V ex...

Page 9: ...lus SCL toggling 20 nV s Pin capacitance Per pin 10 pF POWER DOWN MODE IDD Current flowing into VDD 1 DAC in sleep mode internal reference powered down external reference at 5 5 V 28 µA DAC in sleep mode internal reference enabled additional current through internal reference 10 DAC channels enabled internal reference enabled additional current through internal reference per DAC channel in voltage...

Page 10: ...tup time 0 6 µs tSUSTO Stop condition setup time 0 6 µs tHDDAT Data hold time 0 ns tSUDAT Data setup time 100 ns tLOW SCL clock low period 1300 ns tHIGH SCL clock high period 600 ns tF Clock and data fall time 300 ns tR Clock and data rise time 300 ns tVD_DAT Data valid time 0 9 µs tVD_ACK Data valid acknowledge time 0 9 µs 6 11 Timing Requirements I2C Fast Mode Plus all input signals are timed fr...

Page 11: ...GH SCLK high time 350 ns tSCLKLOW SCLK low time 350 ns tSDIS SDI setup time 8 ns tSDIH SDI hold time 8 ns tCSS SYNC to SCLK falling edge setup time 400 ns tCSH SCLK falling edge to SYNC rising edge 400 ns tCSHIGH SYNC hight time 1 µs tSDODLY SCLK rising edge to SDO falling edge IOL 5 mA CL 20 pF 300 ns 6 14 Timing Requirements SPI Read and Daisy Chain Operation FSDO 1 all input signals are specifi...

Page 12: ...channel specific or independent operations The actual response time of the GPIO is determined by the delay provided by the configured function and the settling time of the DAC 2 The GPIOs can be configured as channel specific or global LDAC function 6 16 Timing Diagrams SCL SDA P S tBUF tHDSTA tLOW tR tHDDAT tHIGH tF tSUDAT tSUSTA tHDSTA S tSUSTO P Low byte ACK cycle Figure 6 1 I2C Timing Diagram ...

Page 13: ...1 Bit 23 Bit 1 Bit 0 tSDODLY ANY COMMAND DATA FROM FIRST READ COMMAND DATA FROM FIRST READ COMMAND tSCLKHIGH tSCLKLOW SYNC Figure 6 3 SPI Read Timing Diagram www ti com DAC53001 DAC53002 DAC63001 DAC63002 SLASF48 MAY 2022 Copyright 2022 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links DAC53001 DAC53002 DAC63001 DAC63002 ...

Page 14: ...6 2 4 3 2 4 CH1 MAX CH0 MAX CH1 MIN CH0 MIN Figure 6 6 Voltage Output INL vs Temperature Supply Voltage V Voltage Output INL LSB 1 8 2 725 3 65 4 575 5 5 4 3 2 2 4 1 6 0 8 0 0 8 1 6 2 4 3 2 4 CH1 MAX CH0 MAX CH1 MIN CH0 MIN Figure 6 7 Voltage Output INL vs Supply Voltage Code Voltage Output DNL LSB 32 544 1056 1568 2080 2592 3104 3616 4064 1 0 8 0 6 0 4 0 2 0 0 2 0 4 0 6 0 8 1 Channel 1 Channel 0 ...

Page 15: ...nnel 0 Internal reference gain 4x Figure 6 12 Voltage Output TUE vs Digital Input Code Code Voltage Output TUE FSR 0 512 1024 1536 2048 2560 3072 3584 4095 1 5 1 2 0 9 0 6 0 3 0 0 3 0 6 0 9 1 2 1 5 Channel 1 Channel 0 Figure 6 13 Voltage Output TUE vs Digital Input Code Temperature C Voltage Output TUE FSR 40 25 10 5 20 35 50 65 80 95 110 125 1 5 1 2 0 9 0 6 0 3 0 0 3 0 6 0 9 1 2 1 5 Channel 1 Cha...

Page 16: ...mA Voltage Output V 5 3 75 2 5 1 25 0 1 25 2 5 3 75 5 2 74 2 742 2 744 2 746 2 748 2 75 2 752 2 754 2 756 2 758 2 76 Channel 1 Channel 0 DAC channels at midscale Figure 6 18 Voltage Output vs Load Current Frequency Hz AC Power Supply Rejection Ratio dB 10 2030 50 100 200 5001000 10000 100000 70 60 50 40 30 20 10 0 10 Figure 6 19 Voltage Output AC PSRR vs Frequency Time s 0 10 20 30 40 50 LDAC 1 V ...

Page 17: ... 1400 1600 VDD 1 V div VOUT 15 mV div DAC in Hi Z power down mode Figure 6 24 Voltage Output Power On Glitch Time s 0 200 400 600 800 1000 1200 1400 1600 VDD 1 V div VOUT 1 mV div DAC at zero scale Figure 6 25 Voltage Output Power Off Glitch Frequency Hz Noise Density V Hz 10 2030 50 100 200 5001000 10000 100000 0 0 3 0 6 0 9 1 2 1 5 1 8 2 1 2 4 2 7 3 Internal reference gain 4x Figure 6 26 Voltage...

Page 18: ...5 0 5 10 15 20 25 30 35 Internal reference gain 4x f 0 1 Hz to 10 Hz Figure 6 28 Voltage Output Flicker Noise Time s Noise Voltage V 0 1 2 3 4 5 6 7 8 9 10 25 20 15 10 5 0 5 10 15 20 25 f 0 1 Hz to 10 Hz Figure 6 29 Voltage Output Flicker Noise DAC53001 DAC53002 DAC63001 DAC63002 SLASF48 MAY 2022 www ti com 18 Submit Document Feedback Copyright 2022 Texas Instruments Incorporated Product Folder Li...

Page 19: ... 0 μA to 240 μA Figure 6 32 Current Output INL vs Digital Input Code Temperature C Current Output INL LSB 40 25 10 5 20 35 50 65 80 95 110 125 1 0 8 0 6 0 4 0 2 0 0 2 0 4 0 6 0 8 1 CH1 MAX CH0 MAX CH1 MIN CH0 MIN Figure 6 33 Current Output INL vs Temperature Supply Voltage V Current Output INL LSB 1 8 2 725 3 65 4 575 5 5 1 0 8 0 6 0 4 0 2 0 0 2 0 4 0 6 0 8 1 CH1 MAX CH0 MAX CH1 MIN CH0 MIN Figure...

Page 20: ...1 CH1 MAX CH0 MAX CH1 MIN CH0 MIN Figure 6 38 Current Output DNL vs Temperature Supply Voltage V Current Output DNL LSB 1 8 2 725 3 65 4 575 5 5 1 0 8 0 6 0 4 0 2 0 0 2 0 4 0 6 0 8 1 CH1 MAX CH0 MAX CH1 MIN CH0 MIN Figure 6 39 Current Output DNL vs Supply Voltage Code Current Output TUE FSR 0 32 64 96 128 160 192 224 255 2 1 6 1 2 0 8 0 4 0 0 4 0 8 1 2 1 6 2 Channel 1 Channel 0 Figure 6 40 Current...

Page 21: ...Current Output Offset Error FSR 40 25 10 5 20 35 50 65 80 95 110 125 1 5 1 2 0 9 0 6 0 3 0 0 3 0 6 0 9 1 2 1 5 Channel 1 Channel 0 Figure 6 45 Current Output Offset Error vs Temperature Temperature C Current Output Gain Error FSR 40 25 10 5 20 35 50 65 80 95 110 125 1 5 1 2 0 9 0 6 0 3 0 0 3 0 6 0 9 1 2 1 5 Channel 1 Channel 0 Figure 6 46 Current Output Gain Error vs Temperature Load Voltage V Cur...

Page 22: ...e 0 μA stored in EEPROM Figure 6 50 Current Output Power On Glitch Time s 0 500 1000 1500 2000 2500 3000 VDD 1 V div IOUT 40 A div DAC at mid scale 0 μA Figure 6 51 Current Output Power Off Glitch Frequency Hz Noise Density nA Hz 10 2030 50 100 200 5001000 10000 100000 0 0 2 0 4 0 6 0 8 1 Output range 0 μA to 250 μA Figure 6 52 Current Output Noise Density Frequency Hz Noise Density nA Hz 10 2030 ...

Page 23: ...nt nA 0 1 2 3 4 5 6 7 8 9 10 25 20 15 10 5 0 5 10 15 20 25 30 f 0 1 Hz to 10 Hz Figure 6 55 Current Output Flicker Noise Frequency Hz AC Power Supply Rejection Ratio LSB V 10 20 30 50 100 200 500 1000 2000 10000 30000 30000 0 2 0 5 1 2 5 10 20 50 100 200 500 Figure 6 56 Current Output AC PSRR vs Frequency www ti com DAC53001 DAC53002 DAC63001 DAC63002 SLASF48 MAY 2022 Copyright 2022 Texas Instrume...

Page 24: ...ansition Time s 0 2 4 6 8 10 VOUT 1 V div VFB 1 LSB div Comparator output in push pull mode Figure 6 58 Comparator Response Time High to Low Transition Temperature C Comparator Offset Error mV 40 25 10 5 20 35 50 65 80 95 110 125 5 4 3 2 1 0 1 2 3 4 5 Channel 1 Channel 0 Figure 6 59 Comparator Offset Error vs Temperature DAC53001 DAC53002 DAC63001 DAC63002 SLASF48 MAY 2022 www ti com 24 Submit Doc...

Page 25: ...erature C Sleep Mode PD Current A 40 25 10 5 20 35 50 65 80 95 110 125 0 3 6 9 12 15 18 21 24 27 30 VDD 1 8 V VDD 3 3 V VDD 5 5 V Sleep mode internal reference disabled Figure 6 62 Power Down Current vs Temperature Temperature C Deep Sleep Mode PD Current A 40 25 10 5 20 35 50 65 80 95 110 125 0 0 5 1 1 5 2 2 5 3 VDD 1 8 V VDD 3 3 V VDD 5 5 V Deep sleep mode Figure 6 63 Power Down Current vs Tempe...

Page 26: ...e configured as SDO in the NVM for SPI read capability The GPIO input can also be configured as FAULT DUMP LDAC PD PROTECT RESET and STATUS functions These devices support deep sleep mode in addition to sleep power down mode Deep sleep mode in which the device draws a very low power down current of 3 μA uses the GPIO pin for power down and wake up Together with ultra low power operation the DACx30...

Page 27: ...The comparator outputs are internally accessible by the device The DACx300x devices include a smart feature set to enable processor less operation and high integration The NVM enables a predictable start up In the absence of a processor or when the processor or software fails the GPIO triggers the DAC output without the I2C interface The integrated functions and the FBx pin enable PWM output for c...

Page 28: ...rmal operation the total power consumption of the device depends on the number of channels powered on and the output mode of each channel voltage or current In current output mode the IDD also depends on the output range The IDD calculation excludes the load current For example in the 250 μA output mode with a DAC setting of 125 μA the total current drawn through the VDD pin is the total IDD plus ...

Page 29: ...tal IO VOUT GAIN X DIS MODE IN EN INT REF DAC Ladder OUTx FBx R1 R2 CMP X HIZ IN DIS or VOUT PDN X Hi Z VOUT PDN X Internal Bandgap IOUT PDN X IOUT RANGE X 10k 100k AGND IOUT PDN X VOUT PDN X Figure 7 2 Voltage Reference Selection and Power Down Logic 7 4 1 1 1 Internal Reference The DACx300x contain an internal reference that is disabled by default To enable the internal reference write 1 to bit ...

Page 30: ...either 10 DAC53001 DAC53002 or 12 DAC63001 DAC63002 DAC_DATA is the decimal equivalent of the binary code that is loaded to the DAC X DATA bit in the DAC X DATA register DAC_DATA ranges from 0 to 2N 1 VDD is used as the DAC reference voltage 7 4 2 Current Output Mode To enter current output mode for each DAC channel disable the respective IOUT PDN X bits in the COMMON CONFIG register and set the r...

Page 31: ...t voltage is clipped Table 7 1 Comparator Output Configuration CMP X EN CMP X OUT EN CMP X OD EN CMP X INV EN CMPX OUT PIN 0 X X X Comparator not enabled 1 0 X X No output 1 1 0 0 Push pull output 1 1 0 1 Push pull and inverted output 1 1 1 0 Open drain output 1 1 1 1 Open drain and inverted output Figure 7 3 shows the interface circuit when all the DAC channels are configured as comparators The p...

Page 32: ... or window operation 01 Hysteresis comparator mode DAC X MARGIN HIGH and DAC X MARGIN LOW registers set the hysteresis 10 Window comparator mode DAC X MARGIN HIGH and DAC X MARGIN LOW registers set the window bounds 11 Invalid setting DAC53001 DAC53002 DAC63001 DAC63002 SLASF48 MAY 2022 www ti com 32 Submit Document Feedback Copyright 2022 Texas Instruments Incorporated Product Folder Links DAC530...

Page 33: ...gister must be greater than the value of the DAC X MARGIN LOW register The comparator output in the hysteresis mode can only be noninverting that is the CMP X INV EN bit in the DAC X VOUT CMP CONFIG register must be set to 0 For the reset to take effect in latching mode the input voltage must be within DAC X MARGIN HIGH and DAC X MARGIN LOW DAC X MARGIN HIGH DAC X MARGIN LOW OUT X FBx AINx CMP X I...

Page 34: ...single comparator is used per channel to check both the margin high and margin low limits of the window Therefore the window comparator function has a finite response time see also Section 6 7 The static behavior of the WIN CMP X bit is not reflected at the output pins Set the CMP X OUT EN bit to 0 The WIN CMP X bit must be read digitally using the communication interface This bit can also be mapp...

Page 35: ...Row2 DAC 1 DATA 15 8 Don t care DAC 1 DATA 15 8 The data captured in the NVM after the fault dump can be read in a specific sequence 1 Set the EE READ ADDR bit to 0b in the COMMON CONFIG register to select row1 of the NVM 2 Trigger the read of the selected NVM row by writing 1 to the READ ONE TRIG in the COMMON TRIGGER register this bit autoresets This action copies that data from the selected NVM...

Page 36: ...ower down of the DAC without impacting the feedback loop of the DC DC converter or the linear regulator Table 7 18 shows how the GPIO pin of the DACx300x can be configured as a PROTECT function PROTECT takes the DAC outputs to a predictable state with a slewed or direct transition This function is useful in systems where a fault condition such as a brownout a subsystem failure or a software crash ...

Page 37: ...s available for CODE STEP X and SLEW RATE X With the default slew rate control setting of no slew the output changes immediately at a rate limited by the output drive circuitry and the attached load When the slew rate control feature is used the output changes happen at the programmed slew rate Figure 7 10 shows that this configuration results in a staircase formation at the output Do not write to...

Page 38: ...E PERIOD PER STEP DAC X FUNC CONFIG 0 0 0 0 No slew default 0 0 0 1 4 µs 0 0 1 0 8 µs 0 0 1 1 12 µs 0 1 0 0 18 µs 0 1 0 1 27 µs 0 1 1 0 40 5 µs 0 1 1 1 60 75 µs 1 0 0 0 91 13 µs 1 0 0 1 136 69 µs 1 0 1 0 239 2 µs 1 0 1 1 418 61 µs 1 1 0 0 732 56 µs 1 1 0 1 1281 98 µs 1 1 1 0 2563 96 µs 1 1 1 1 5127 92 µs DAC53001 DAC53002 DAC63001 DAC63002 SLASF48 MAY 2022 www ti com 38 Submit Document Feedback Co...

Page 39: ...ns The EN PMBUS bit in the INTERFACE CONFIG register must be set to 1 to enable the PMBus protocol ALERT CONTROL DATA CLOCK ADDRESS WP ALERT CONTROL DATA CLOCK ADDRESS WP ALERT CONTROL DATA CLOCK ADDRESS WP System Host Bus Controller PMBus compatible device 1 Alert signal Control signal Data Clock Optional Required PMBus compatible device 2 PMBus compatible device 3 Figure 7 11 PMBus Connections w...

Page 40: ...K Sr MSB R W 1 ACK MSB LSB ACK MSB LSB ACK Address byte Section 7 5 2 2 1 Command byte Section 7 5 2 2 2 Sr Address byte Section 7 5 2 2 1 LSDB MSDB Optional From controller Target From controller Target From controller Target From target Controller From target Controller The DACx300x I2C interface implements some of the PMBus commands Table 7 9 shows the supported PMBus commands that are implemen...

Page 41: ...ection 7 6 2 MARGIN_LOW is the DAC X MAGIN LOW specified in Section 7 6 3 7 4 5 2 2 Sawtooth Waveform Generation The sawtooth and the inverse sawtooth waveforms use the DAC X MARGIN LOW and DAC X MARGIN HIGH registers for minimum and maximum levels respectively Equation 8 shows that the frequency of the waveform depends on the min and max levels CODE STEP and SLEW RATE settings An external RC load...

Page 42: ...ssible through the VOUT GAIN X bits in the DAC X VOUT CMP CONFIG register Table 7 10 shows the list of hard coded discrete points for the sine wave with 12 bit resolution and Figure 7 12 shows the pictorial representation of the sine wave There are four phase settings available for the sine wave that are selected using the PHASE SEL X bit in the DAC X FUNC CONFIG register Table 7 10 Sine Wave Data...

Page 43: ...set Power on reset 0 7 V Undefined 0 V 1 65 V 1 71 V 5 5 V VDD V Specified supply voltage range Figure 7 13 Threshold Levels for VDD POR Circuit 7 4 6 2 External Reset An external reset to the device can be triggered through the GPIO pin or through the register map To initiate a device software reset event write reserved code 1010 to the RESET field in the COMMON TRIGGER register A software reset ...

Page 44: ...on NVM CRC FAIL USER bit indicates that the user programmable NVM data are corrupt During this condition all registers in the DAC are initialized with factory reset values and any DAC registers can be written to or read from To reset the alarm bits to 0 issue a software reset command see also Section 7 4 6 2 or cycle power to the DAC A software reset or power cycle also reloads the user programmab...

Page 45: ... Hi Z 1 0 1 Power down VOUT X with 100 kΩ to AGND Power down IOUT X to Hi Z 1 1 1 Power down VOUT X to Hi Z Power down IOUT X to Hi Z default 1 1 0 Power down VOUT X to Hi Z Power up IOUT X 7 4 7 1 Deep Sleep Mode The DACx300x provide a deep sleep mode where the internal LDO and most of the common functional blocks are powered down The GPIO pin must be used to enter and exit this mode The I2C or S...

Page 46: ... command and the 7 bit address that is to be accessed The last 16 bits in the cycle form the data cycle Table 7 12 SPI Read Write Access Cycle BIT FIELD DESCRIPTION 23 R W Identifies the communication as a read or write command to the address register R W 0 sets a write operation R W 1 sets a read operation 22 16 A 6 0 Register address specifies the register to be accessed during the read or write...

Page 47: ...ast 24 bits are used by the device first device in the chain If the access cycle contains clock edges that are not in multiples of 24 the SPI packet is ignored by the device Figure 7 17 describes the packet format for the daisy chain write cycle SDI SDO SCLK SYNC TI SPI Device TI SPI Device TI SPI Device C B A SDI SDO SCLK SYNC SDI SDO SCLK SYNC RPULL UP VIO RPULL UP VIO RPULL UP VIO Figure 7 16 S...

Page 48: ... The DACx300x family supports the following data transfer modes Standard mode 100 kbps Fast mode 400 kbps Fast mode plus 1 0 Mbps The data transfer protocol for standard and fast modes is exactly the same therefore both modes are referred to as F S mode in this document The fast mode plus protocol is supported in terms of data transfer speed but not output current The low level output current woul...

Page 49: ...ablished 3 The controller generates further SCL cycles to transmit R W bit 0 or receive R W bit 1 data to the target In either case the receiver must acknowledge the data sent by the transmitter The acknowledge signal can be generated by the controller or by the target depending on which is the receiver The 9 bit valid data sequences consists of eight data bits and one acknowledge bit and can cont...

Page 50: ...wledgement signal from target Generate ACKNOWLEDGE signal Sr or P P Sr REPEATED START or STOP condition Recognize STOP or REPEATED START condition ACK Figure 7 21 I2C Bus Protocol The command byte sets the operating mode of the selected DACx300x device For a data update to occur when the operating mode is selected by this byte the DACx300x device must receive two data bytes the most significant da...

Page 51: ...OMMENT MSB LSB AD6 AD5 AD4 AD3 AD2 AD1 AD0 R W General address 1 0 0 1 See Target Address column in Table 7 16 0 or 1 Broadcast address 1 0 0 0 1 1 1 0 Table 7 16 Address Format TARGET ADDRESS A0 PIN 000 AGND 001 VDD 010 SDA 011 SCL The DACx300x supports broadcast addressing which is used for synchronously updating or powering down multiple DACx300x devices When the broadcast address is used the D...

Page 52: ...ration In the GPIO CONFIG register write 1 to the GPI EN bit to set the GPIO pin as an input or write 1 to the GPO EN bit to set the pin as output There are global and channel specific functions mapped to the GPIO pin For channel specific functions select the channels using the GPI CH SEL field in the GPIO CONFIG register Table 7 18 lists the functional options available for the GPIO as input and ...

Page 53: ... per GPI CH SEL Falling edge Stop function generation Rising edge Start function generation 1010 As per GPI CH SEL Falling edge Trigger margin low Rising edge Trigger margin high 1011 All Low pulse Trigger device RESET The RESET configuration must be programmed into the NVM Rising edge No effect 1100 All Falling edge Allows NVM programming Rising edge Blocks NVM programming 1101 All Falling edge A...

Page 54: ... LO 1 TRIG MAR HI 1 START FUNC 1 X RST CMP FLAG 0 TRIG MAR LO 0 TRIG MAR HI 0 START FUNC 0 GENERAL STATUS NVM CRC FAIL INT NVM CRC FAIL USER X DAC BUSY 0 X DAC BUSY 1 NVM BUSY DEVICE ID CMP STATUS X PROTECT FLAG WIN CMP 0 X WIN CMP 1 CMP FLAG 0 X CMP FLAG 1 GPIO CONFIG GF EN DEEP SLEEP EN GPO EN GPO CONFIG GPI CH SEL GPI CONFIG GPI EN DEVICE MODE CONFIG RESERVED DIS MODE IN RESERVED PROTECT CONFIG...

Page 55: ...on 7 6 8 1Fh FFh E3h COMMON CONFIG Section 7 6 9 20h FFh E4h COMMON TRIGGER Section 7 6 10 21h FFh E5h COMMON DAC TRIG Section 7 6 11 22h FFh E6h GENERAL STATUS Section 7 6 12 23h FFh E7h CMP STATUS Section 7 6 13 24h FFh E8h GPIO CONFIG Section 7 6 14 25h FFh E9h DEVICE MODE CONFIG Section 7 6 15 26h FFh EAh INTERFACE CONFIG Section 7 6 16 2Bh FFh EFh SRAM CONFIG Section 7 6 17 2Ch FFh F0h SRAM D...

Page 56: ...R Read Write Type W W Write Reset or Default Value n Value after reset or the default value DAC53001 DAC53002 DAC63001 DAC63002 SLASF48 MAY 2022 www ti com 56 Submit Document Feedback Copyright 2022 Texas Instruments Incorporated Product Folder Links DAC53001 DAC53002 DAC63001 DAC63002 ...

Page 57: ...0 DAC63002 DAC X MARGIN HIGH 11 0 DAC53001 DAC X MARGIN HIGH 9 0 X X DAC53002 DAC X MARGIN HIGH 9 0 X X X Don t care bits 3 0 X X 0 Don t care 7 6 3 DAC X MARGIN LOW Register address 14h 02h reset 0000h PMBus page address 03h 00h PMBus register address 26h Figure 7 24 DAC X MARGIN LOW Register X 0 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DAC6300x DAC X MARGIN LOW 11 0 DAC5300x DAC X MARGIN LOW 9 0 ...

Page 58: ... 5 X X 0h Don t care 4 CMP X OD EN R W 0 0 Set OUTx pin as push pull 1 Set OUTx pin as open drain in comparator mode CMP X EN 1 and CMP X OUT EN 1 3 CMP X OUT EN R W 0 0 Generate comparator output but consume internally 1 Bring comparator output to the respective OUTx pin 2 CMP X HIZ IN DIS R W 0 0 FBx input has high impedance Input voltage range is limited 1 FBx input is connected to resistor div...

Page 59: ... X X 000h Don t care 7 6 6 DAC X CMP MODE CONFIG Register address 17h 05h reset 0000h PMBus page address FFh PMBus register address DFh D3h Figure 7 27 DAC X CMP MODE CONFIG Register X 0 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X CMP X MODE X X 0h R W 0h X 0h Table 7 28 DAC X CMP MODE CONFIG Register Field Descriptions Bit Field Type Reset Description 15 12 X X 00h Don t care 11 10 CMP X MODE R W 0...

Page 60: ...ons Bit Field Type Reset Description 12 11 PHASE SEL X R W 0 00 0 01 120 10 240 11 90 10 8 FUNC CONFIG X R W 0 000 Triangular wave 001 Sawtooth wave 010 Inverse sawtooth wave 100 Sine wave 111 Disable function generation Others Invalid 7 LOG SLEW EN X R W 0 0 Enable linear slew 6 4 CODE STEP X R W 0 CODE STEP for linear slew mode 000 1 LSB 001 2 LSB 010 3 LSB 011 4 LSB 100 6 LSB 101 8 LSB 110 16 L...

Page 61: ...3125 times the current step When DAC X MARGIN LOW is 0 the slew starts from code 1 The time interval for each step is defined by RISE SLEW X and FALL SLEW X 6 4 RISE SLEW X R W 0 SLEW RATE for logarithmic slew mode DAC X MARGIN LOW to DAC X MARGIN HIGH 000 4 µs step 001 12 µs step 010 27 04 µs step 011 60 72 µs step 100 136 72 µs step 101 418 64 µs step 110 1282 µs step 111 5127 92 µs step 3 1 FAL...

Page 62: ...W 0h R W 0h R W 11b R W 1b X 11h R W 11b R W 1b Table 7 33 COMMON CONFIG Register Field Descriptions Bit Field Type Reset Description 15 WIN LATCH EN R W 0 0 Non latching window comparator output 1 Latching window comparator output 14 DEV LOCK R W 0 0 Device not locked 1 Device locked the device locks all the registers To set this bit back to 0 unlock device write to the unlock code to the DEV UNL...

Page 63: ...f resets 6 CLR R W 0 0 DAC registers and outputs unaffected 1 DAC registers and outputs set to zero code or mid code based on the respective CLR SEL X bit in the DAC X FUNC CONFIG register This bit self resets 5 X X 0 Don t care 4 FAULT DUMP R W 0 0 Fault dump is not triggered 1 Triggers fault dump sequence This bit self resets 3 PROTECT R W 0 0 PROTECT function not triggered 1 Trigger PROTECT fun...

Page 64: ...P FLAG X W 0 0 Latching comparator output unaffected 1 Reset latching comparator and window comparator output This bit self resets 14 2 TRIG MAR LO X W 0 0 Don t care 1 Trigger margin low command This bit self resets 13 1 TRIG MAR HI X W 0 0 Don t care 1 Trigger margin high command This bit self resets 12 0 START FUNC X R W 0 0 Stop function generation 1 Start function generation as per FUNC GEN C...

Page 65: ...ror in NVM loading 1 Indicates a failure in NVM loading The register settings are corrupted The device allows all operations during this error condition Reprogram the NVM to get original state A software reset brings the device out of this temporary error condition 13 X R 0 Don t care 12 DAC 0 BUSY R 0 0 DAC 0 channel can accept commands 1 DAC 0 channel does not accept commands 11 10 X X 0 Don t c...

Page 66: ...8 7 6 5 4 3 2 1 0 GF EN X GPO EN GPO CONFIG GPI CH SEL GPI CONFIG GPI EN R W 0h X 0h R W 0h R W 0h R W 0h R W 0h R W 0h Table 7 38 GPIO CONFIG Register Field Descriptions Bit Field Type Reset Description 15 GF EN R W 0 0 Glitch filter disabled for GP input This setting provides faster response 1 Glitch filter enabled for GPI This setting introduces additional propagation delay but provides robustn...

Page 67: ... and the GPI CH SEL must be configured for every channel 1001 Start and stop function generation channel specific GPIO falling edge stops function generation GPIO rising edge starts function generation 1010 Trigger margin high low channel specific GPIO falling edge triggers margin low GPIO rising edge triggers margin high 1011 RESET input global The falling edge of the GPIO pin asserts the RESET f...

Page 68: ... margin high code and then switch to Hi Z power down 7 5 RESERVED R W 0 Always write 0b000 4 0 X R W 00h Don t care 7 6 16 INTERFACE CONFIG Register address 26h reset 0000h Figure 7 37 INTERFACE CONFIG Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X TIMEOUT EN X EN PMBUS X FSDO EN X SDO EN X 0h R W 0h X 0h R W 0h X 0h R W 0h X 0h R W 0h Table 7 40 INTERFACE CONFIG Register Field Descriptions Bit ...

Page 69: ...the address configured in the SRAM CONFIG register 7 6 19 BRDCAST DATA Register address 50h reset 0000h PMBus page address FFh PMBus register address F1h Figure 7 40 BRDCAST DATA Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DAC6300x BRDCAST DATA 11 0 DAC5300x BRDCAST DATA 9 0 X R W 0h X 0h Table 7 43 BRDCAST DATA Register Field Descriptions Bit Field Type Reset Description 15 4 DAC6300x BRDCAST ...

Page 70: ...ds 00h Turn off 80h Turn on A4h Margin high DAC output margins high to DAC X MARGIN HIGH code 94h Margin low DAC output margins low to DAC X MARGIN LOW code 7 0 X X 00h Not applicable 7 6 22 PMBUS CML Register reset 0000h PMBus page address X PMBus register address 78h Figure 7 43 PMBUS CML Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X CML X N A X 00h R W 0h X 0h X 00h Table 7 46 PMBUS CML Regi...

Page 71: ... VERSION X R 22h X 00h Table 7 47 PMBUS VERSION Register Field Descriptions Bit Field Type Reset Description 15 8 PMBUS VERSION R 22h PMBus version 7 0 X X 00h Not applicable www ti com DAC53001 DAC53002 DAC63001 DAC63002 SLASF48 MAY 2022 Copyright 2022 Texas Instruments Incorporated Submit Document Feedback 71 Product Folder Links DAC53001 DAC53002 DAC63001 DAC63002 ...

Page 72: ... by default Configure the GPIO pin as SDO in the NVM for SPI readback capability The SPI clock speed in readback mode is slower than in write mode Power down mode sets the DAC outputs to Hi Z by default Change the configuration appropriately for different power down settings The DAC channels can also power up with a programmed DAC code in NVM 8 2 Typical Application A power supply margining and sc...

Page 73: ...n the output and SENSE pin of the power converter To calculate the value of R3 first decide the DAC output range and make sure to avoid the codes near zero scale and full scale for safe operation in the linear region A DAC output of 20 mV is a safe consideration as the minimum output and 1 8 V 0 6 V 20 mV 1 18 V as the maximum output When the DAC output is at 20 mV the power supply goes to margin ...

Page 74: ...els WRITE GPIO CONFIG 0x24 0x01 0x35 Set slew rate and code step repeat for all channels CODE_STEP 2 LSB SLEW_RATE 60 72 µs step WRITE DAC 0 FUNC CONFIG 0x18 0x00 0x17 Write DAC margin high code repeat for all channels For a 1 8 V output range the 10 bit hex code for 1 164 V is 0x296 With 16 bit left alignment this becomes 0xA540 WRITE DAC 0 MARGIN HIGH 0x13 0xA5 0x40 Write DAC margin low code rep...

Page 75: ...or signal integrity separate the digital and analog traces and place decoupling capacitors close to the device pins 10 2 Layout Example 1 2 3 4 12 11 10 9 Decoupling Capacitor GND GND LDO Bypass Capacitor VDD DACx3002 OUT1 5 6 7 8 16 15 14 13 FB1 FB0 OUT0 GND GND VREF Bypass Capacitor VDD VREF Pullup Resistor VIO VIO VIO VIO GPIO SDO SCL SYNC A0 SDI SDA SCLK DACx3001 Figure 10 1 Layout Example Not...

Page 76: ...nstruments All trademarks are the property of their respective owners 11 4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD Texas Instruments recommends that all integrated circuits be handled with appropriate precautions Failure to observe proper handling and installation procedures can cause damage ESD damage can range from subtle performance degradation to complete ...

Page 77: ...eshold Antimony trioxide based flame retardants must also meet the 1000ppm threshold requirement 3 MSL Peak Temp The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications and peak solder temperature 4 There may be additional marking which relates to the logo the lot trace code information or the environmental category on the device 5 Multiple Device Markings wi...

Page 78: ...PACKAGE OPTION ADDENDUM www ti com 4 Aug 2022 Addendum Page 2 ...

Page 79: ...GE VIEW This image is a representation of the package family actual package may vary Refer to the product data sheet for package details WQFN 0 8 mm max height RTE 16 PLASTIC QUAD FLATPACK NO LEAD 3 x 3 0 5 mm pitch 4225944 A ...

Page 80: ...ON 2 0 1 0 2 PIN 1 INDEX AREA 0 08 SEATING PLANE 1 4 9 12 5 8 16 13 OPTIONAL PIN 1 ID 0 1 C A B 0 05 EXPOSED THERMAL PAD 17 SYMM SYMM NOTES 1 All linear dimensions are in millimeters Any dimensions in parenthesis are for reference only Dimensioning and tolerancing per ASME Y14 5M 2 This drawing is subject to change without notice 3 The package thermal pad must be soldered to the printed circuit bo...

Page 81: ...This package is designed to be soldered to a thermal pad on the board For more information see Texas Instruments literature number SLUA271 www ti com lit slua271 5 Vias are optional depending on application refer to device data sheet If any vias are implemented refer to their locations shown on this view It is recommended that vias under paste be filled plugged or tented SOLDER MASK OPENING METAL ...

Page 82: ... B 04 2022 NOTES continued 6 Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release IPC 7525 may have alternate design recommendations SYMM ALL AROUND METAL SOLDER PASTE EXAMPLE BASED ON 0 125 mm THICK STENCIL EXPOSED PAD 17 85 PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE 25X SYMM 1 4 5 8 9 12 13 16 17 ...

Page 83: ...o change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of these resources is prohibited No license is granted to any other TI intellectual property right or to any third party intellectual property right TI disclaims responsibility for and you will fully indemn...

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