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EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
16X (0.24)
16X (0.6)
(
0.2) TYP
VIA
12X (0.5)
(2.8)
(2.8)
(0.58)
TYP
(
1.68)
(R0.05)
ALL PAD CORNERS
(0.58) TYP
WQFN - 0.8 mm max height
RTE0016C
PLASTIC QUAD FLATPACK - NO LEAD
4219117/B 04/2022
SYMM
1
4
5
8
9
12
13
16
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
17
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED
METAL