WE866 HW User Guide
1VV0301330 Rev. 3
Page
38
of
54
2018-03-13
Solder paste
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
Solder Reflow
Recommended solder reflow profile
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
Summary of Contents for WE866
Page 1: ...04 2016 Mod 0805 2016 08 Rev 5 WE866 HW User Guide 1VV0301330 Rev 3 2018 03 13 13...
Page 10: ...WE866 HW User Guide 1VV0301330 Rev 3 Page 10 of 54 2018 03 13 Related Documents...
Page 33: ...WE866 HW User Guide 1VV0301330 Rev 3 Page 33 of 54 2018 03 13 7 MECHANICAL DESIGN Drawing...
Page 54: ...04 2016 Mod 0805 2016 08 Rev 5...
