WE866 HW User Guide
1VV0301330 Rev. 3
Page
36
of
54
2018-03-13
It is also suggested, as common rule for an SMT component, to avoid having a
mechanical parts of the application in direct contact with the module.
Tip or Information – In the customer application, the region under
WIRING INHIBIT (see figure above) must be clear from signal or
ground paths.
PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
PCB pad dimensions
It is not recommended to place via or micro-via not covered by solder resist in an area of
0.3 mm around the pads unless it carries the same signal of the pad itself (see following
figure).
Summary of Contents for WE866
Page 1: ...04 2016 Mod 0805 2016 08 Rev 5 WE866 HW User Guide 1VV0301330 Rev 3 2018 03 13 13...
Page 10: ...WE866 HW User Guide 1VV0301330 Rev 3 Page 10 of 54 2018 03 13 Related Documents...
Page 33: ...WE866 HW User Guide 1VV0301330 Rev 3 Page 33 of 54 2018 03 13 7 MECHANICAL DESIGN Drawing...
Page 54: ...04 2016 Mod 0805 2016 08 Rev 5...
