WE866 HW User Guide
1VV0301330 Rev. 3
Page
37
of
54
2018-03-13
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni /
Immersion Au
3 –7 / 0.03 – 0.15
Good solderability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-
free process. This issue should be discussed with the PCB-supplier. Generally, the
wettability of tin-lead solder paste on the described surface plating is better compared to
lead-free solder paste.
It is not necessary to panel the application PCB, however in that case it is suggested to
use milled contours and predrilled board breakouts; scoring or v-cut solutions are not
recommended.
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
Summary of Contents for WE866
Page 1: ...04 2016 Mod 0805 2016 08 Rev 5 WE866 HW User Guide 1VV0301330 Rev 3 2018 03 13 13...
Page 10: ...WE866 HW User Guide 1VV0301330 Rev 3 Page 10 of 54 2018 03 13 Related Documents...
Page 33: ...WE866 HW User Guide 1VV0301330 Rev 3 Page 33 of 54 2018 03 13 7 MECHANICAL DESIGN Drawing...
Page 54: ...04 2016 Mod 0805 2016 08 Rev 5...
