TDT RZ2, Manual

Page: 438 / 736

10-24 System 3
ZIF-Clip® ZCD Digital Headstages
Important! When using multiple headstages, ensure that a single ground is used for all
headstages. This will avoid unnecessary noise contamination in recordings. See
“Headstage Connection Guide” on page 6-93, for more information.
ZIF ‐ Clip® Headstage Pinouts
If you are interested in using a third party electrode see “ZIF-Clip® Headstage
Adapters” on page 12-3. If there is no adapter offered for the desired electrode, the
following diagrams show the headstage pinouts (channel connections to the amplifier)
and board dimensions for connectors to match ZIF-Clip® headstages. A black square
guide is used to align the headstage to ZIF-Clip® compatible connectors and can be
used in the diagrams below to orient “left” and “right” sides of the headstage shell.
Channel numbers are relative to the manifold connection to which they are connected.
16 ‐ and 32 ‐ Channel Headstage Pinouts
Images are not to scale. Pinouts are looking through the headstage shell (or into a
matching board connector). All board dimensions are in millimeters and are identical
for both sides, board thickness is 0.75 mm, and connectors are centered as shown.
Anti-Aliasing Filter
3rd order low-pass (-18 dB per octave)
Distortion (typical)
< 1%
Channel Cross Talk
-75 dB
Dimensions (Approx.)
Headstage Length Length Width Thickness Thickness
Open Closed Open Closed
ZCD32 16.107 mm 16.050 mm 10.500 mm 8.137 mm 7.400 mm
ZCD64 16.446 mm 16.497 mm 15.500 mm 12.760 mm 10.400 mm
ZCD96 17.469 mm 17.562 mm 19.000 mm 12.577 mm 10.499 mm