CHAPTER 4: Thermal Specifications
Figure 4-4.
Tape Path Thermal Measurement Locations
4.4
SDLT 220/320 Thermal Profile
This section lists the temperature of key module components and media at the
extremes of the SDLT 220/320 operating specification as well as at room
temperature. Both styles of bezel were tested: 1) Embedded, and 2) Library.
N
OTE
: The information in this thermal profile section is not
intended to serve as a temperature specification, nor is it
intended to replace the temperature specifications of
individual chips or chipsets. This information is provided
by Tandberg Data solely as a guideline, and is representative
of temperatures that you can expect to observe during typical
tape drive operation.
Hd Bd
Thermal
Sensor
Media
Temp
Sensor
Summary of Contents for SDLT220-320 INTEGRATION
Page 1: ...TANDBERG Super DLTTM Design Intergration Guide Revision 1 June 2002 432588 01...
Page 4: ...SDLT 220 and SDLT 320 Design Integration Guide...
Page 18: ...CHAPTER 1 Introduction...
Page 24: ...CHAPTER 2 General Drive Specifications Figure 2 6 Front Views of SDLT 220 320 Tape Drive...
Page 53: ...CHAPTER 4 Thermal Specifications Figure 4 3 HIM Board Thermal Measurement Location Qlogic...
Page 80: ...CHAPTER 6 SCSI and Controller Interface Specification...
Page 86: ...CHAPTER 7 Updating the Firmware...
Page 93: ......