Tandberg Data SDLT220-320 INTEGRATION, Manual

Page: 51 / 94

CHAPTER 4: Thermal Specifications
4.3 Thermal Measurement Locations
The Electronics Interface Module (EIM) comprises two boards: the Integrated
Controller Module (ICM) board, and the Host Interface Module (HIM) board.
Temperatures are measured on the ICM board in the locations shown in
Figure 4-2 ,
on the HIM board on the Qlogic chip shown in Figure 4-3 , and on the drive’s front
bezel in the locations shown in Figure 4-4 .
N
OTE
: While the most critical temperatures are usually found
along the tape path, data for other key areas inside the
drive, such as the processor and other important circuits
and chips that are known to produce heat, are included as
well.