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X10SLE-DF User’s Manual
Motherboard Features
CPU
•
Single Intel® Xeon E3-1200 v3, 4th-Generation Core
i3, Pentium, or a Celeron processor in an LGA1150
H3 socket for each node;
•
Two (2) processors onboard (CPU1/CPU2)
Memory
•
Four (4) DIMM slots support up to 32 GB of
DDR3 VLP (Very-Low-Profile) Unbuffered ECC
1600/1333/1066 MHz memory for each node;
•
Eight (8) memory modules support up to 64 GB of
DDR3 memory onboard for both nodes combined
Dual-channel memory
DIMM sizes
UDIMM
1 GB, 2 GB, 4GB, and 8GB
Chipset
•
Single Intel® C224 Express PCH for each node;
•
Two (2) PCH chips onboard (PCH1/PCH2)
Expansion Slots
One (1) SMC-proprietary Micro Add-On card slot for Power/
SIG SATA interface
I/O Devices
SATA Connections
SATA 3.0 (6 Gb/s)
Four (4) I-SATA 3.0 connections on
the HDD backplane supported by Intel
C224 PCH
RAID 0, 1
USB 2.0/KVM (UART) Connector on the IO Backplane
Two (2) USB 2.0 shared with KVM (VGA/COM) for front
access support (JKVM1);
KVM: VGA (Monitor)/COM (UART) connector for remote
console redirection or remote network interface
LAN Controllers
•
Single Intel i350 dual-channel Gigabit-LAN control-
ler with support of two LAN-ports (LAN Ports 1/2)
for each node;
•
Two (2) Intel i350 LAN controllers onboard
BMC Controllers
•
Single Aspeed AST2400 BMC controller for IPMI and
graphics support for each node;
•
Two (2) AST2400 BMC controllers onboard (BMC1/2)
