Sun Microsystems 5500, Reference Manual

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Chapter 1 Product Overview 1-7
1.5 Internal Options
Orientation of Power/Cooling Module, Board, and UltraSPARC II Module
Front Edge nearest you as you face the unit installed in a system
Right Side to your right as you face the front of the installed unit
Left Side to your left as you face the front of the installed unit
TABLE 1-2
Internal Options for the Sun Enterprise Server Systems
Option Enterprise 6500
Enterprise
5500/4500
Comments
CPU/
boards,
SBus+ I/O
boards,
G
I/O boards,
and PCI+
I/O boards 16, maximum 8, maximum Each slot can accept any of these four types of boards:
CPU/ board, SBus+ I/O board, G I/O
board, and PCI+ I/O board. Combinations can vary. One
CPU/ board becomes the system master
automatically. Jumper changes are not needed to select the
system master. For easy cable connections, I/O+ boards
should be installed at the rear of the card cage, although
CPU/ boards and I/O+ boards will work in
either the front or rear of the card cage.
Disk boards 2 per system
(must use slot
15 if only 1 is
installed) 4 per system Can be installed only in slot 14 and slot 15 in the
Enterprise 6500 system.
For easier Disk boards cabling, CPU/ boards
can be installed in the front and Disk boards in the rear of
the Enterprise system.
UltraSPARC II
modules 30 14 0-2 modules on each CPU/ board.
Memory
modules 0, 8, or 16
SIMMs per
CPU/
board 0, 8, or 16
SIMMs per
CPU/
board SIMM sizes are 8, 32, or 128 Mbyte DRAM. Do not mix
sizes within the same bank.
Add 8 SIMMs at a time. Install SIMMs in all bank 0
sockets first on each CPU/ board, from the
lowest slot to the highest. Once bank 0 is full, install
remaining SIMMs in bank 1 sockets in the same order.
SBus cards 15 per system 7 per system 0-3 cards per SBus+ I/O board, 0-2 cards per G
I/O board.
Graphics (UPA)
cards 4 per system 4 per system 0-1 card per G I/O board.
TABLE 1-1
Definitions of Terms (Continued)