DocID025832 Rev 2
STM32F042xx
Package characteristics
115
Figure 44. UFQFPN32 - 5
x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must
be connected. It is referred to as pin 0 in
12: Legend/abbreviations used in the pinout table
.
Se
a
ting pl
a
ne
ddd
C
C
A
3
A1
A
D
e
9
16
17
24
3
2
Pin # 1 ID
R = 0.
3
0
8
E
L
L
D2
1
b
E2
A0B
8
_ME
Bottom view
Table 69. UFQFPN32 – 5 x 5
mm, 32-lead ultra thin fine pitch quad flat no-lead package
mechanical data
Dim.
millimeters
inches
(1)
Min
Typ
Max
Min
Typ
Max
A
0.5
0.55
0.6
0.0197
0.0217
0.0236
A1
0.00
0.02
0.05
0
0.0008
0.0020
A3
-
0.152
-
-
0.006
-
b
0.18
0.23
0.28
0.0071
0.0091
0.0110
D
4.90
5.00
5.10
0.1929
0.1969
0.2008
D2
-
3.50
-
-
0.1378
-
E
4.90
5.00
5.10
0.1929
0.1969
0.2008
E2
3.40
3.50
3.60
0.1339
0.1378
0.1417
e
-
0.500
-
-
0.0197
-
L
0.30
0.40
0.50
0.0118
0.0157
0.0197
ddd
0.08
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
