6 (E)
PCS-G70N/G70NP/G70NP2
PCS-G70S/G70SP
Contents
The following is a summary of all the sections for understanding the contents of this
manual.
Section 1
Service Overview
Describes the system configuration, power source, board layouts, removal and
installation of cabinet, matching connectors and cables, input/output signals of
connectors.
Section 2
Replacement of Main Parts and Boards
Explains the replacement of mechanical parts and circuit boards of the unit.
Section 3
Operation Description
Illustrates the block diagrams which show the function and signal flow, and de-
scribes the outlines of the circuits.
Section 4
Operation Check and Troubleshooting
Explains how to perform operation checks and the measures against trouble.
Section 5
Spare Parts
Describes the exploded views, the mechanical parts list, and the electrical list.
Section 6
Semiconductor Pin Assignments
This section contains information on semiconductors used for the unit.
It includes a complete list of the semiconductors and their ID Nos. for retrieving
information on “Semiconductor Pin Assignments” CD-ROM, which is available
separately.
Please refer to this section together with the “Semiconductor Pin Assignments” CD-
ROM.
Information on the semiconductors not contained in the latest CD-ROM at the time
of issue of this manual, if any, is given in this section as well.
Section 7
Schematic Diagrams
Describes the schematic diagrams and frame wiring of each board.
Section 8
Board Layouts
Describes the board layouts and locations of components.
Trademarks
Trademarks and registered trademarks used in this manual are follows.
.
Memory Stick is trademark of Sony Corporation.
Other system names, product names, and company names appearing in this manual
are trademarks or registered trademarks of their respective holders.
