MDR-42
Technical Data
ROTEC technology
- 38 -
9.5. CPU, CHIPSET and SUPER I/O
9.5.1. CPU
The central processing unit(CPU) consists of:
Mobile Intel
®
Pentium
®
M, which includes such features as:
Supports Intel® Architecture with Dynamic Execution
High performance, low-power core
On-die, primary 32-kbyte instruction cache and 32-kbyte write-back data cache
On-die, 1-Mbyte second level cache with Advanced Transfer Cache Architecture
Advanced Branch Prediction and Data Prefetch Logic
Streaming SIMD Extensions 2 (SSE2)
400-MHz, Source-Synchronous processor system bus
Advanced Power Management features including Enhanced Intel SpeedStep®
technology
9.5.2. Chipset
The chipset consists of:
Intel® 855GM (north bridge)
Intel® 82801DB (south bridge
9.5.3. Super I/O
The super I/O device is a Winbond 83627HF
Summary of Contents for MDR-42
Page 1: ...MDR 42 Ruggedized POI PC Display User Manual you ROTEC ...
Page 2: ......
Page 14: ...MDR 42 Important Safety Information ROTEC technology 12 ...
Page 28: ...MDR 42 Technical Data ROTEC technology 26 9 3 Mechanical dimensions ...
Page 42: ...MDR 42 Technical Data ROTEC technology 40 9 8 BLOCK DIAGRAM ...