50
APPENDIX B DIMENSIONS OF CONVERSION SOCKET AND RECOMMENDED BOARD MOUNTING PATTERN
Fig. B-4 Recommended Board Mounting Pattern of EV-9200G-64 (reference )
A
F
D
E
B
G
J
K
C
L
M
H
I
0.039
×
0.709=0.709
0.039
×
0.472=0.472
EV-9200G-64-P0
ITEM
MILLIMETERS
INCHES
A
B
C
D
E
F
G
H
I
J
K
L
M
25.7
21.0
15.2
19.9
11.00±0.08
5.50±0.03
5.00±0.08
2.50±0.03
0.6±0.02
2.36±0.03
1.57±0.03
1.012
0.827
0.598
0.783
0.433
0.217
0.197
0.098
0.024
0.093
0.062
1.0±0.02
×
18=18.0±0.05
1.0±0.02
×
12=12.0±0.05
φ
φ
+0.002
–0.001
+0.002
–0.003
+0.002
–0.001
+0.003
–0.002
+0.004
–0.003
+0.001
–0.002
+0.003
–0.004
+0.002
–0.001
+0.001
–0.002
+0.001
–0.002
φ
φ
+0.001
–0.002
Dimensions of mount pad for EV-9200 and that for target
device (QFP) may be different in some parts. For the
recommended mount pad dimensions for QFP, refer to
"SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL" (IEI-1207).
Caution
Summary of Contents for IE-78044-R-EM
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