2
Product Specifications
16
Component height between module and carrier board
Parts mounted on the bottom surface of CE915GM modules (between the module and
the carrier board) have a maximum height of 3.8mm. This affects the maximum allowable
height of carrier board components underneath the module.
•
If the carrier board has module-to-carrier interconnectors 5mm in height, the
clearance between the carrier board and the bottom surface of the module’s PCB is
5mm. This limits the height of carrier board components underneath the module to
1mm.
•
If the carrier board has module-to-carrier interconnectors 8mm in height, the
clearance between the carrier board and the bottom surface of the module’s PCB is
8mm. This allows the use of carrier board components underneath the module up to
4mm in height.
Physical interfaces
DDR2 SO-DIMM slot
The 200-pin DDR2 SDRAM SO-DIMM memory slot complies with the JEDEC standard. For
pinout definitions, refer to the JEDEC DDR2 Specification at
www.jedec.org
.
Board-to-board interconnectors
The CE915GM board-to-board interconnector complies with the
PICMG COM Express
Base Specification Version 1.0
. For pinout definitions of the board-to-board
interconnector and required/optional features of COM Express pinout type 2, see
Appendix A, COM Express Module Pinout Definitions, on page 45
.
If you are designing a custom carrier board for CE915GM modules, refer to the
Carrier
Board Design Guidelines
for special notes.
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