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PRODUCT SPECIFICATIONS
Mechanical
The size of the CE915GM modules’ printed circuit board (PCB) is 95mm x 125mm, which
complies with the Basic Module Size outlined in the
PICMG COM Express Specification
Revision 1.0
. The thickness of the PCB is 0.079 inch [2mm].
Figure 4
—
Figure 7
show the form factor and envelope dimensions of CE915GM modules
in millimeters [inches]. The holes shown are intended for mounting the module and
thermal solution to the carrier board.
The dimension tolerance is ±0.25mm. The tolerance of the locating peg holes on the
board-to-board interconnector (dimensions [16.50, 6.00] and [16.50, 18.00]) is ±0.10mm.
Figure 4. Basic form factor
95.00 [3.740]
91.00 [3.583]
91.00 [3.583]
0 [.000]
[000.] 0
18.00 [.709]
6.00 [.236]
4.00 [.157]
Pin D1
Pin A1
125.00 [4.921]
121.00 [4.764]
80.00 [3.150]
16.50 [.650]
4.00 [].157
Board-to-board interconnector
is on opposite side of the board
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