2
Hardware Description
24
Heatsinks
The
CPU
heatsinks
are
called
out
in
Figure 4
.
In
addition
to
the
CPU
heatsinks,
the
Intel
C600
series
PCH,
and
the
Mellanox
CX3
10/40
GbE
controller
each
have
individual
heatsinks.
The
CPM
incorporates
a
large
heatsink
covering
each
processor
plus
the
additional
heatsinks
for
other
onboard
high
power
devices
to
support
a
maximum
CPM
subsystem
power
dissipation
of
up
to
50W.
In
addition,
the
installed
RDIMM
modules
might
also
have
their
own
heatsinks
or
other
thermal
solution.
W
ARNING
!
All
heatsinks
on
the
CPM
are
critical
for
proper
board
operation.
Make
sure
all
heatsinks
have
adequate
mechanical
and
thermal
contact
with
their
associated
components
and
ensure
the
sheet
metal
cooling
shroud
is
secured
in
place
before
installing
the
CPM
in
its
slot.
Major components
Figure 4
calls
out
the
following
major
components
on
the
CPM
board:
•
Two
Intel
Xeon
E5
‐
2400
family
processors.
Refer
to
Intel®
Xeon®
E5
‐
2400
family
processor
on
page 25
for
detailed
information.
•
Sockets
for
twelve
registered
DIMM
memory
modules
(six
for
each
CPU).
Refer
to
DIMM
memory
on
page 28
for
detailed
information.
•
The
C600
series
PCH
component.
Refer
to
Intel
C600
series
Platform
Controller
Hub
(PCH)
on
page 29
for
detailed
information.
•
Mellanox
CX3
dual
10/40
GbE
Ethernet
controller.
Refer
to
Mellanox
dual
40GbE
controller
on
page 36.
In
addition
to
the
components
called
out
in
Figure 4
,
the
following
components
(indicated
in
the
Figure 1
block
diagram)
control
significant
portions
of
CPM
operation:
•
The
H8S/2400
series
IPMI
controller.
Refer
to
IPMI
controller
on
page 33
for
more
detailed
information.
•
CPU
Complex
FPGA
(
CPU
Complex
(CC)
FPGA
on
page 34)
and
IPMC
FPGA
(
IPMI
controller
on
page 33)
modules.
•
The
Intel
I350
quad
GbE
Ethernet
controller.
Refer
to
Intel
I350
quad
GbE
Ethernet
controller
on
page 36.
•
Clock
synthesizer
subsystem.
Refer
to
Clock
synthesizer
subsystem
on
page 37.
•
Reset
subsystems.
Refer
to
Reset
subsystems
on
page 37.
•
Trusted
Platform
Module
(TPM).
Refer
to
Trusted
Platform
Module
(TPM)
on
page 42.
•
Optional
MXM
Type
A
video
module.
Refer
to
MXM
type
A
video
module
(optional)
on
page 43.
•
Optional
1.8”
Solid
State
Drive
(SSD)
module(s).
Refer
to
1.8”
Solid
State
Drive
(SSD)
module
(optional)
on
page 43.
•
Optional
eUSB
Embedded
Flash
module(s).
Refer
to
eUSB
Embedded
Flash
module
(optional)
on
page 44.
