Quectel QuecOpen BG952A-GL, Hardware Design

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LPWA Module Series
BG952A-GL_QuecOpen_Hardware_Design 10 / 72
Figure Index
Figure 1: Functional Diagram of BG952A-GL ............................................................................................. 15
Figure 2: Pin Assignment (Top View) .......................................................................................................... 18
Figure 3: Power Supply Limits during Burst Transmission ......................................................................... 28
Figure 4: Star Structure of the Power Supply ............................................................................................. 29
Figure 5: Auto Power-on Circuit ...................................................................................................................30
Figure 6: Turn on the Module with a Driving Circuit ....................................................................................31
Figure 7: Turn on the Module with a Button ................................................................................................ 31
Figure 8: Power-up Timing ...........................................................................................................................32
Figure 9: Power-down Timing (PWRKEY) .................................................................................................. 33
Figure 10: Reference Circuit of RESET_N with a Driving Circuit ...............................................................34
Figure 11: Reference Circuit of RESET_N with a Button ............................................................................34
Figure 12: Reset Timing ...............................................................................................................................34
Figure 13: Reference Circuit of PON_TRIG ................................................................................................35
Figure 14: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector ......................... 36
Figure 15: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector ............................37
Figure 16: Reference Design of USB Interface ...........................................................................................38
Figure 17: Main UART Reference Design (Translator Chip) ...................................................................... 40
Figure 18: Main UART Reference Design (Transistor Circuit) ....................................................................41
Figure 19: Reference Design of I2C Interface with an External I2C Interface Sensor .............................. 42
Figure 20: Reference Design of NET_STATUS .......................................................................................... 44
Figure 21: Reference Design of STATUS ....................................................................................................45
Figure 22: Reference Design of Main Antenna Interface ............................................................................49
Figure 23: Reference Design of GNSS Antenna Interface ......................................................................... 50
Figure 24: Microstrip Design on a 2-layer PCB ...........................................................................................51
Figure 25: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 51
Figure 26: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 52
Figure 27: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 52
Figure 28: Dimensions of the U.FL-R-SMT Connector (Unit: mm) .............................................................54
Figure 29: Mechanicals of U.FL-LP Connectors ......................................................................................... 54
Figure 30: Space Factor of Mated Connectors (Unit: mm) .........................................................................54
Figure 31: Module Top and Side Dimensions ............................................................................................. 62
Figure 32: Bottom Dimensions (Bottom View) ............................................................................................ 63
Figure 33: Recommended Footprint (Top View) ......................................................................................... 64
Figure 34: Top and Bottom Views ................................................................................................................65
Figure 35: Recommended Reflow Soldering Thermal Profile .................................................................... 67
Figure 36: Carrier Tape Dimension Drawing ...............................................................................................69
Figure 37: Plastic Reel Dimension Drawing ................................................................................................69
Figure 38: Packaging Process .....................................................................................................................70