LPWA Module Series
BG952A-GL_QuecOpen_Hardware_Design
66 / 72
8
Storage, Manufacturing and
Packaging
8.1. Storage
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity
should be 35–60 %.
2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
3. The floor life of the module is 168 hours
1)
in a plant where the temperature is 23 ±5 °C and relative
humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the
module should be stored in an environment where the relative humidity is less than 10 % (e.g. a
drying cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
The module is not stored in Recommended Storage Condition;
Violation of the third requirement above occurs;
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 ±5 °C;
All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be
put in a dry environment such as in a drying oven.
