LPWA Module Series
BG952A-GL_QuecOpen_Hardware_Design
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7.2. Recommended Footprint
40x1.0
40x1.0
62x0.7
62x1.10
19.90±0.20
23
.6
0±
0.
20
9.95
9.95
7.45
7.15
0.55
1.95
1.10
1.10
9.15
9.15
0.25
1.00
1.00
1.9
0
11
.8
0
11
.8
0
11
.0
0
11
.0
0
1.70
0.85
1.70
0.85
1.70
5.9
5
5.9
5
4.2
5
4.2
5
7.6
5
7.6
5
9.7
0
9.6
0
1.70
0.85
2.55
4.25
5.95
4.25
5.95
1.7
0
1.70
2.50
2.50
1.10
1.10
1.10
1.10
1.10
0.70
1.00
1.00
0.25
0.25
0.25
0.2
0
0.15
Figure 33: Recommended Footprint (Top View)
1. Keep at least 3 mm between the module and other components on the motherboard to improve
soldering quality and maintenance convenience.
2. All reserved pins must be kept open.
3. For stencil design requirements of the module, see
document [6]
.
NOTES
Pin 1
