4
DJS-1000
1
2
3
4
A
B
C
D
E
F
1
2
3
4
1. SERVICE PRECAUTIONS
1.1 NOTES ON SOLDERING
1.2 NOTES ON REPLACING
1.3 SERVICE NOTICE
• For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.
Do NOT use a soldering iron whose tip temperature cannot be controlled.
The part listed below is difficult to replace as a discrete component part.
It the failure of suspected that are listed in the table, replace whole A
SS
Y.
ASSY Name
Ref. No
Part No.
Function
Remarks
MAIN A
SS
Y
IC201
MM
3
54
3
BH
DC/DC Converter
IC with heat-pad
IC202
MM
3
54
3
BH
DC/DC Converter
IC with heat-pad
IC204
TP
S
2557DRB
U
S
B Power
S
W
IC with heat-pad
IC400
MM
3
54
3
BH
DC/DC Converter
IC with heat-pad
IC401
TP
S
2557DRB
U
S
B Power
S
W
IC with heat-pad
IC402
BD
8
1A04EFV-M
DC/DC Converter
IC with heat-pad
IC600
MMPF0100F0AEP
Power Management IC
IC with heat-pad
IC1000
K4B4G1646E-BCMA
DDR
3
-RAM
BGA
IC1001
K4B4G1646E-BCMA
DDR
3
-RAM
BGA
IC2000
MCIMX6Q6AVT10AD
MAIN uCOM
BGA
IC2001
THGBMHG6C1LBAWL
eMMC
BGA
JA1600
DKN11
88
MIDI OUT/THRU Terminal (DIN)
Terminal part with through-hole
JA1601
DKN11
88
MIDI IN Terminal (DIN)
Terminal part with through-hole
JA2200
AKN7115
LAN Terminal (RJ-45)
Terminal part with through-hole
JA2201
DKN12
3
7
U
S
B-B Terminal
Terminal part with through-hole
LCDB A
SS
Y
IC
3
400
R1290K10
3
A
DC/DC Converter
IC with heat-pad
S3
001
D
S
X10
8
0
Rotary
S
elector (ENCODER)
Terminal part with through-hole
AUDB A
SS
Y
IC500
8
NJW4155GM1-A
DC/DC Converter
IC with heat-pad
IC5500
AK4452VN
OUT1/2 DAC
IC with heat-pad
IC5700
AK4452VN
Headphone DAC
IC with heat-pad
JA5502
DKB1120
OUTPUT1 Terminal
Terminal part with through-hole
S
5000
A
S
G1102
Power
S
W
Terminal part with through-hole
U
S
BA A
SS
Y
JA5
8
00
DKB111
8
U
S
B-A Terminal
Terminal part with through-hole
CDCB A
SS
Y
IC7700
AD7147ACPZ500RL7
CDC (Capacitance
S
ensors IC)
IC with heat-pad
• Performance pad was calibrated when the product is produced. If a relevant part is replaced with a new one, be sure to
carry out the calibration.
• For the method of calibration, refer to "PAD CALIBRATION MODE" in "6.1 TE
S
T MODE".
• If you forget to carry out the calibration, power for tapping the performance pad and degree of sound volume when
the sampler velocity mode is turned ON vary depending on the pad.
• Calibration execution data is memorized in the MAIN A
SS
Y. Be sure to carry out the calibration when the MAIN A
SS
Y is
replaced new one.
Calibration of performance pad
• Don`t touch the black parts of the PADB A
SS
Y (side-A) and black mat parts of the
S
ensor (16 pieces each, which are
pressure sensitive ) with your bare hands.
Clear the dust between the PADB A
SS
Y,
S
heet,
S
ensor and Button by air blast when you assemble the sensor.
About PADB ASSY of sensors (Pressure sensitive)
• Clear the dust between inside of the Cap, Buttons and PCBs by air blast to remove the foreign particles when you assemble
S
EQB A
SS
Y or BARB A
SS
Y.
Caution: Control Panel and Chassis unit in the state that has wire does not open 180 degrees.
About SEQB ASSY and BARB ASSY
• Replacement of the NAND (IC1200) in the MAIN A
SS
Y is not possible during service, because writing of the MAC address
on the production line is required. Therefore, the NAND (IC1200) are not supplied as a service part. If the NAND is defective,
replace the whole MAIN A
SS
Y.
About the NAND:Flash ROM IC(IC1200) in the MAIN ASSY
