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SP
193C-E-PMA01-A04-00
PrintCondition
8. Suck
Choose whether or not to perform the suction function during cleaning motion in order to prevent
the mask aperture from being clogged with solder. But when a wet process is chosen, the suction
function can not be performed.
Mask cleaning
Dry cleaning: Removes solder balls and flux (of the aperture and the back of mask).
Wet cleaning: Removes residual flux in the form of thin film (of the back of mask).
NOTICE
When using a wet cleaning, it is recommended to use it for “Forward” of the sec-
ond cleaning in 2-round cleaning mode.
If a wet cleaning is used in 1-round cleaning mode, the cleaning performance may
be deteriorated depending on the type of solder.
Recommended conditions for mask cleaning
• Cleaning tact time (In the case that board size
is 330 X 250)
1 round: About 32 seconds
2 round: About 70 seconds
∗
If the cleaning performance is not good on the
left conditions, reduce the cleaning speed
more.
Forward
Backward
Forward
Backward
Dry
Dry
Wet
Dry
1
2
Removes solder balls and flux.
Removes residual flux in the form of thin film.
Removes residual solvent.
∗
Solder paste
= Solder balls + Flux
Forward
Backward
Forward
Backward
40
40
20
10
1
2
Dry
Dry
Damp
Dry
ON
ON
OFF
ON
Speed
mm/s
Form
Suck
Summary of Contents for SP22P
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