Page 34
PrintCondition
193C-E-PMA01-A04-01
8-3
CleaningData
1. Motion mode
2. Cleaning
3. Interval
4. ProcessWaitCleaning
5. WaitTime
6. Speed
7. Form
8. Suck
Above contents are as follows.
1. Motion mode
Choose 1trip (1-round cleaning) or 2trip (2-round cleaning) for periodic cleaning.
2. Cleaning
Choose whether or not to perform cleaning motion on the board contacting surface of mask.
3. Interval
Set the board printing quantity that shows the interval of cleaning motion.
4. ProcessWaitCleaning
Choose whether or not to perform cleaning motion during waiting time such as the wait for the next
process, etc.
5. WaitTime
Input the wait time when carrying out ProcessWaitCleaning.
6. Speed
Set the speed of cleaning motion.
7. Form
Choose a cleaning type, wet or dry process.
∗
Only to remove the flux of solder on mask, choose a wet process. And it is not possible to choose
a wet process for the backward cleaning motion.
Summary of Contents for SP22P
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