55
Backplane Insulation Plates
If there is an electric potential difference between grounds when devices are
wired separately, then use a Backplane Insulation Plate. There are four models
available, corresponding to the number of slots in the Backplane. The dimen-
sions at locations A, B, C, D, and E are shown below in millimeters for each Back-
plane Insulation Plate model.
M4 screws for mounting to PC
(4/5 places)
5-dia. holes for mounting
Base Insulation Plate
(4/6 places)
135 (118) 110
(B)
C
D
(A)
(E)
12 dia.
6
5 dia.
10
Insulation Plates for CPU Backplanes
Specifications
Model
Dimensions (mm)
p
E
D
C
B
A
For 3 slots
C200H-ATT31
261
210
---
---
246
For 5 slots
C200H-ATT51
331
280
---
---
316
For 8 slots
C200H-ATT81
436
385
---
---
421
For 10 slots
C200H-ATTA1
506
455
227.5
270.5
491
Insulation Plates for CPU Backplanes
Specifications
Model
Dimensions (mm)
p
E
D
C
B
A
For 3 slots
C200HW-ATT32
190
140
---
---
175
For 5 slots
C200HW-ATT52
260
210
---
---
245
For 8 slots
C200HW-ATT82
365
315
---
---
350
For 10 slots
C200HW-ATTA2
435
385
---
---
420
3-1-5 DIN Track Mounting
The PC may be mounted using DIN track if desired. This type of mounting is not
required, and the PC may be directly mounted to any sturdy support meeting the
environmental specifications (refer to Appendix B Specifications). If you want to
mount the PC on DIN track, you can order a DIN Track from OMRON (refer to
Appendix B Standard Models). DIN Tracks come in the two heights shown
below.
Note Never use DIN Track to mount Backplane in locations subject to vibration.
Installation Environment
Section 3-1
