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Preliminary User’s Manual U17763EE1V1UD00
Chapter 11
Recommended Soldering Conditions
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor
Device:
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended please consult NEC.
Caution:
Do not use two or more soldering methods in combination (except partial heating
method).
Soldering Method
Soldering Condition
Symbol of Recommended
Soldering Condition
Infrared reflow
Package peak temperature: 235°C
IR35-207-3
Partial heating
350°C
P350
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