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Caution

■ 

Limitation of use

     Please contact our sales representatives or product engineers before using our products for the applications
     listed below which require of our products for other applications than specified in this product.

   ①

Aircraft equipment   

Aerospace equipment     

Undersea equipment   

Power plant control equipment

   ⑤

Medical equipment   

Transportation equipment(vehicles,trains,ships,etc.)    

Traffic signal equipment

   ⑧

Disaster prevention / crime prevention equipment      

Data-processing equipment

   ⑩

Application of similar complexity and/or requirements to the applications listed in the above

 Storage and  Operation condition

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

 1-1. Store capacitors in the following conditions: Temperature of +5

 to +40

 and a Relative Humidity

        of 20% to 70%.

  (1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity 
        conditions during storage may affect the solderability and the packaging performance
        Please use product within six months of receipt. 

  (2) Please confirm solderability before using after six months. 
        Store the capacitors without opening the original bag.
        Even if the storage period is short, do not exceed the specified atmospheric conditions.

 1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
         in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,  
         hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).

 1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused 
        by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and 
        electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity 
        conditions

!

JEMCGC-2701V

12

Summary of Contents for GRM21BF51A475ZA01 Series

Page 1: ...20 30 to 85 C 82 to 22 30 to 85 C 25 C 3 Temperature Characteristics Public STD Code Y5V EIA Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Change 5 Nominal Capacitance 6 Capa...

Page 2: ...each Temperature tolerance Table A 25 C to 85 C specified temp stage Characteristics R1 R7 Within 15 1 Temperature Compensating Type 55 C to 125 C The temperature coefficient is determind using the c...

Page 3: ...seconds at 230 5 or Sn 3 0Ag 0 5Cu solder solution for 2 0 5 seconds at 245 5 14 Resistance to Appearance No defects or abnormalities Preheat the capacitor at 120 to 150 for 1 minute Soldering Heat I...

Page 4: ...mperature Appearance No defects or abnormalities Apply 200 of the rated voltage at the maximum Load operating temperature 3 for 1000 12 hours Capacitance Within 3 or 0 3pF B1 B3 R1 R6 R7 R9 C7 C8 L8 W...

Page 5: ...dr Fig 1 in mm Fig 3 in mm Fig 2 in mm SPECIFICATIONS AND TEST METHODS Type Dimension mm a b c GRM02 0 2 0 56 0 23 GRM03 0 3 0 9 0 3 GRM15 0 4 1 5 0 5 GRM18 1 0 3 0 1 2 GRM21 1 2 4 0 1 65 GRM31 2 2 5...

Page 6: ...000 GR 18 4000 10000 5 6 9 4000 3000 10000 A B 3000 10000 6 9 4000 10000 M X 3000 10000 C 2000 6000 5 6 9 4000 10000 A M 3000 10000 N 2000 8000 C 2000 6000 R D E 1000 4000 M 1000 5000 N C R D 1000 400...

Page 7: ...ance 0 05 GR 15 Dimensions Tolerance 0 05 GR 15 Dimensions Tolerance 0 1 GR 15 Dimensions Tolerance 0 15 GR 15 Dimensions Tolerance 0 2 A 3 0 37 0 39 0 65 0 70 0 72 0 75 B 3 0 67 0 69 1 15 1 20 1 25 1...

Page 8: ...1 05 0 1 1 10 0 1 1 05 0 1 1 55 0 15 2 0 0 2 2 8 0 2 B 1 85 0 1 2 00 0 1 2 00 0 1 2 3 0 15 3 6 0 2 3 6 0 2 8 0 0 3 4 0 0 1 3 5 0 05 1 75 0 1 2 0 0 1 1 5 0 1 0 1 7 max T 1 25mm 2 5 max T 1 35 1 6mm 3...

Page 9: ...e GR 43 GR 55 A 2 3 6 5 2 B 2 4 9 6 1 2 Nominal value Package GRM F Type 1 5 0 1 0 4 0 0 1 8 0 0 1 1 5 0 2 0 12 0 0 3 5 5 0 1 1 75 0 1 1 2 5 max T 1 8mm 3 7 max T 2 0 2 5mm 4 7 max T 2 8mm 1 2 0 0 1 0...

Page 10: ...ecified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence W w1 GR 02 8 0 max 5 1 5 GR 32 max 16 5 max 10 1 5 GR 43 55 20 5 max 14 1 5 180 0 3 0 330 2 0 50 mi...

Page 11: ...There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dimension is sh...

Page 12: ...ght dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wit...

Page 13: ...tended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measuremen...

Page 14: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Page 15: ...ure characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors change d...

Page 16: ...ted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting position...

Page 17: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Page 18: ...ions Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accumulat...

Page 19: ...maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to chips not listed in Table 2 Table 2 Temperature Different...

Page 20: ...Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GR 03 15 18 the top of the solder fillet should be lower than 2 3...

Page 21: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Page 22: ...and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed circu...

Page 23: ...can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged...

Page 24: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Page 25: ...sibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk o...

Page 26: ...GR 32 3 2 2 5 2 0 2 4 1 0 1 2 1 8 2 3 GR 43 4 5 3 2 3 0 3 5 1 2 1 4 2 3 3 0 GR 55 5 7 5 0 4 0 4 6 1 4 1 6 3 5 4 8 in mm GR 21 1 9 2 1 1 0 1 3 1 7 1 9 2 0 1 25 0 15 1 2 0 6 0 8 1 2 1 4 GR 31 3 2 1 6 wi...

Page 27: ...rol curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a deterioration of So...

Page 28: ...ed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resi...

Page 29: ...cation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if you...

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