Murata GRM21BF51A475ZA01 Series Reference Sheet Download | Manualshive

Page: 9 / 29

background image

(6)GR

□

43/55

(in:mm)

Code

GR

□

43

GR

□

55

A *2

3.6

5.2

B *2

4.9

6.1

*2 Nominal value

Package

GRM/F Type

φ1.5

+0.1
-0

4.0±0.1

8.0±0.1

φ1.5

+0.2
-0

12

.0

±

0.3

5.5

±

0.1

1.75

±

0.1

Ａ

*

2.0±0.1

*1
2.5 max.(T≦1.8mm)
3.7 max.(T=2.0/2.5mm)
4.7 max.(T≧2.8mm)

4.0±0.1

Ｂ

*1

*：2.0±0.1

0.3±0.1

JEMCGP-01796

9

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Summary of Contents for GRM21BF51A475ZA01 Series

Page 1: ...20 30 to 85 C 82 to 22 30 to 85 C 25 C 3 Temperature Characteristics Public STD Code Y5V EIA Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Change 5 Nominal Capacitance 6 Capa...

Page 2: ...each Temperature tolerance Table A 25 C to 85 C specified temp stage Characteristics R1 R7 Within 15 1 Temperature Compensating Type 55 C to 125 C The temperature coefficient is determind using the c...

Page 3: ...seconds at 230 5 or Sn 3 0Ag 0 5Cu solder solution for 2 0 5 seconds at 245 5 14 Resistance to Appearance No defects or abnormalities Preheat the capacitor at 120 to 150 for 1 minute Soldering Heat I...

Page 4: ...mperature Appearance No defects or abnormalities Apply 200 of the rated voltage at the maximum Load operating temperature 3 for 1000 12 hours Capacitance Within 3 or 0 3pF B1 B3 R1 R6 R7 R9 C7 C8 L8 W...

Page 5: ...dr Fig 1 in mm Fig 3 in mm Fig 2 in mm SPECIFICATIONS AND TEST METHODS Type Dimension mm a b c GRM02 0 2 0 56 0 23 GRM03 0 3 0 9 0 3 GRM15 0 4 1 5 0 5 GRM18 1 0 3 0 1 2 GRM21 1 2 4 0 1 65 GRM31 2 2 5...

Page 6: ...000 GR 18 4000 10000 5 6 9 4000 3000 10000 A B 3000 10000 6 9 4000 10000 M X 3000 10000 C 2000 6000 5 6 9 4000 10000 A M 3000 10000 N 2000 8000 C 2000 6000 R D E 1000 4000 M 1000 5000 N C R D 1000 400...

Page 7: ...ance 0 05 GR 15 Dimensions Tolerance 0 05 GR 15 Dimensions Tolerance 0 1 GR 15 Dimensions Tolerance 0 15 GR 15 Dimensions Tolerance 0 2 A 3 0 37 0 39 0 65 0 70 0 72 0 75 B 3 0 67 0 69 1 15 1 20 1 25 1...

Page 8: ...1 05 0 1 1 10 0 1 1 05 0 1 1 55 0 15 2 0 0 2 2 8 0 2 B 1 85 0 1 2 00 0 1 2 00 0 1 2 3 0 15 3 6 0 2 3 6 0 2 8 0 0 3 4 0 0 1 3 5 0 05 1 75 0 1 2 0 0 1 1 5 0 1 0 1 7 max T 1 25mm 2 5 max T 1 35 1 6mm 3...

Page 9: ...e GR 43 GR 55 A 2 3 6 5 2 B 2 4 9 6 1 2 Nominal value Package GRM F Type 1 5 0 1 0 4 0 0 1 8 0 0 1 1 5 0 2 0 12 0 0 3 5 5 0 1 1 75 0 1 1 2 5 max T 1 8mm 3 7 max T 2 0 2 5mm 4 7 max T 2 8mm 1 2 0 0 1 0...

Page 10: ...ecified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence W w1 GR 02 8 0 max 5 1 5 GR 32 max 16 5 max 10 1 5 GR 43 55 20 5 max 14 1 5 180 0 3 0 330 2 0 50 mi...

Page 11: ...There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dimension is sh...

Page 12: ...ght dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wit...

Page 13: ...tended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measuremen...

Page 14: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Page 15: ...ure characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors change d...

Page 16: ...ted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting position...

Page 17: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Page 18: ...ions Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accumulat...

Page 19: ...maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to chips not listed in Table 2 Table 2 Temperature Different...

Page 20: ...Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GR 03 15 18 the top of the solder fillet should be lower than 2 3...

Page 21: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Page 22: ...and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed circu...

Page 23: ...can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged...

Page 24: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Page 25: ...sibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk o...

Page 26: ...GR 32 3 2 2 5 2 0 2 4 1 0 1 2 1 8 2 3 GR 43 4 5 3 2 3 0 3 5 1 2 1 4 2 3 3 0 GR 55 5 7 5 0 4 0 4 6 1 4 1 6 3 5 4 8 in mm GR 21 1 9 2 1 1 0 1 3 1 7 1 9 2 0 1 25 0 15 1 2 0 6 0 8 1 2 1 4 GR 31 3 2 1 6 wi...

Page 27: ...rol curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a deterioration of So...

Page 28: ...ed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resi...

Page 29: ...cation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if you...

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