Murata GRM21BF51A475ZA01 Series, Reference Sheet

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2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB
bending / etc if the land area is larger than needed and has an excess
amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Dimensions
Part Number
GR
□
31 3.2×1.6 2.2
～
2.6 1.0
～
1.1 1.0
～
1.4
(in mm)
Table 2 Reflow Soldering Method
Dimensions
Part Number
GR
□
02 0.4×0.2 0.16
～
0.2 0.12
～
0.18 0.2
～
0.23
GR
□
32 3.2×2.5 2.0
～
2.4 1.0
～
1.2 1.8
～
2.3
GR
□
43 4.5×3.2 3.0
～
3.5 1.2
～
1.4 2.3
～
3.0
GR
□
55 5.7×5.0 4.0
～
4.6 1.4
～
1.6 3.5
～
4.8
(in mm)
GR
□
21
1.9
～
2.1 1.0
～
1.3 1.7
～
1.9
2.0×1.25
(
±
0.15)
1.2 0.6
～
0.8 1.2
～
1.4
GR
□
31
3.2×1.6
(within
±
0.20)
1.8
～
2.0 0.9
～
1.2 1.5
～
1.7
3.2×1.6
(
±
0.30)
1.2
～
1.4
2.0×1.25
(
±
0.20)
0.9
～
1.0 0.8
～
1.1
GR
□
18
2.0×1.25
(within
±
0.10)
1.2 0.6 1.25
1.0
～
1.4 0.6
～
0.8
c
Notice
Chip
（
L×W
）
a b c
0.8
～
0.9 0.6
～
0.8
2.0×1.25 1.0
～
1.2 GR
□
21
1.6×0.8 0.6
～
1.0
0.6×0.3 0.2
～
0.3 0.2
～
0.35
a
L×W
（
Dimensions
Tolerance
）
b
GR
□
03 0.2
～
0.4
0.3
～
0.5 0.35
～
0.45 0.4
～
0.6
1.6×0.8
(within ±0.10)
1.0×0.5
（
±0.15/±0.20
）
0.4
～
0.6 0.40
～
0.50 0.5
～
0.7
GR
□
15
GR
□
18
1.6×0.8
(±0.15/±0.20)
0.7
～
0.9 0.7
～
0.8 0.8
～
1.0
0.6
～
0.8 0.6
～
0.7 0.6
～
0.8
1.0×0.5
(within
±
0.10)
Chip Capacitor
Land
Solder Resist
a b
C
JEMCGC-2701V 26