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Notice

6.Washing

1. Please evaluate a capacitor by actual cleaning equipment and condition surely 
    for confirming the quality and select the applicable solvent.

2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of
    electrical characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.
 3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the
        performance of the capacitors.

7.Coating

1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during
 

 

curing process.

    The stress is affected by the amount of resin and curing contraction.
    Select a resin with small curing contraction.
    The difference in the thermal expansion coefficient between a coating resin or a molding resin and
    capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and
    lead to the deterioration of insulation resistance or dielectric breakdown.
    Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.
    A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic.
    Using hygroscopic resins under high humidity conditions may cause the deterioration of the
    insulation resistance of a capacitor.
    An epoxy resin can be used as a less hygroscopic resin.

 Others

1.Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

 1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force
        during transportation.

   (1) Climatic condition 
      

 low air temperature

:-

40

      

 change of temperature air/air

:-

25

/

25

      

 low air pressure

30 kPa

      

 change of air pressure

6 kPa/min

   (2) Mechanical condition 
        Transportation shall be done in such a way that the boxes are not deformed and forces are not directly
        passed on to the inner packaging.

 1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.

   (1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may
        occur in the ceramic body of the capacitor.

   (2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the
        surface of capacitor, the capacitor may crack and short-circuit.

 1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
        The capacitor dropped accidentally during processing may be damaged.

JEMCGC-2701V

28

Summary of Contents for GRM21BF51A475ZA01 Series

Page 1: ...20 30 to 85 C 82 to 22 30 to 85 C 25 C 3 Temperature Characteristics Public STD Code Y5V EIA Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Change 5 Nominal Capacitance 6 Capa...

Page 2: ...each Temperature tolerance Table A 25 C to 85 C specified temp stage Characteristics R1 R7 Within 15 1 Temperature Compensating Type 55 C to 125 C The temperature coefficient is determind using the c...

Page 3: ...seconds at 230 5 or Sn 3 0Ag 0 5Cu solder solution for 2 0 5 seconds at 245 5 14 Resistance to Appearance No defects or abnormalities Preheat the capacitor at 120 to 150 for 1 minute Soldering Heat I...

Page 4: ...mperature Appearance No defects or abnormalities Apply 200 of the rated voltage at the maximum Load operating temperature 3 for 1000 12 hours Capacitance Within 3 or 0 3pF B1 B3 R1 R6 R7 R9 C7 C8 L8 W...

Page 5: ...dr Fig 1 in mm Fig 3 in mm Fig 2 in mm SPECIFICATIONS AND TEST METHODS Type Dimension mm a b c GRM02 0 2 0 56 0 23 GRM03 0 3 0 9 0 3 GRM15 0 4 1 5 0 5 GRM18 1 0 3 0 1 2 GRM21 1 2 4 0 1 65 GRM31 2 2 5...

Page 6: ...000 GR 18 4000 10000 5 6 9 4000 3000 10000 A B 3000 10000 6 9 4000 10000 M X 3000 10000 C 2000 6000 5 6 9 4000 10000 A M 3000 10000 N 2000 8000 C 2000 6000 R D E 1000 4000 M 1000 5000 N C R D 1000 400...

Page 7: ...ance 0 05 GR 15 Dimensions Tolerance 0 05 GR 15 Dimensions Tolerance 0 1 GR 15 Dimensions Tolerance 0 15 GR 15 Dimensions Tolerance 0 2 A 3 0 37 0 39 0 65 0 70 0 72 0 75 B 3 0 67 0 69 1 15 1 20 1 25 1...

Page 8: ...1 05 0 1 1 10 0 1 1 05 0 1 1 55 0 15 2 0 0 2 2 8 0 2 B 1 85 0 1 2 00 0 1 2 00 0 1 2 3 0 15 3 6 0 2 3 6 0 2 8 0 0 3 4 0 0 1 3 5 0 05 1 75 0 1 2 0 0 1 1 5 0 1 0 1 7 max T 1 25mm 2 5 max T 1 35 1 6mm 3...

Page 9: ...e GR 43 GR 55 A 2 3 6 5 2 B 2 4 9 6 1 2 Nominal value Package GRM F Type 1 5 0 1 0 4 0 0 1 8 0 0 1 1 5 0 2 0 12 0 0 3 5 5 0 1 1 75 0 1 1 2 5 max T 1 8mm 3 7 max T 2 0 2 5mm 4 7 max T 2 8mm 1 2 0 0 1 0...

Page 10: ...ecified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence W w1 GR 02 8 0 max 5 1 5 GR 32 max 16 5 max 10 1 5 GR 43 55 20 5 max 14 1 5 180 0 3 0 330 2 0 50 mi...

Page 11: ...There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dimension is sh...

Page 12: ...ght dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wit...

Page 13: ...tended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measuremen...

Page 14: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Page 15: ...ure characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors change d...

Page 16: ...ted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting position...

Page 17: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Page 18: ...ions Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accumulat...

Page 19: ...maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to chips not listed in Table 2 Table 2 Temperature Different...

Page 20: ...Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GR 03 15 18 the top of the solder fillet should be lower than 2 3...

Page 21: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Page 22: ...and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed circu...

Page 23: ...can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged...

Page 24: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Page 25: ...sibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk o...

Page 26: ...GR 32 3 2 2 5 2 0 2 4 1 0 1 2 1 8 2 3 GR 43 4 5 3 2 3 0 3 5 1 2 1 4 2 3 3 0 GR 55 5 7 5 0 4 0 4 6 1 4 1 6 3 5 4 8 in mm GR 21 1 9 2 1 1 0 1 3 1 7 1 9 2 0 1 25 0 15 1 2 0 6 0 8 1 2 1 4 GR 31 3 2 1 6 wi...

Page 27: ...rol curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a deterioration of So...

Page 28: ...ed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resi...

Page 29: ...cation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if you...

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