CONTENTS
MultiConnect
®
mDot
TM
MTDOT Developer Guide for Japan
5
About Schematics........................................................................................................................................................ 43
Block Diagram ............................................................................................................................................................. 44
Schematics .................................................................................................................................................................. 45
Developer Kit Package Contents............................................................................................................................... 50
Firmware Updates..................................................................................................................................................... 50
Windows Drivers ...................................................................................................................................................... 50
Micro DK Mechanical Drawings .................................................................................................................................. 51
Micro Developer Board Components ......................................................................................................................... 52
Installing an mDot on a Micro Developer Board ........................................................................................................ 52
Assembly Diagrams and Schematics ........................................................................................................................... 53
Assembly Diagrams ................................................................................................................................................... 53
Schematics ................................................................................................................................................................ 54
Noise Suppression Design ........................................................................................................................................... 59
PC Board Layout Guideline ......................................................................................................................................... 59
Electromagnetic Interference .................................................................................................................................... 59
Electrostatic Discharge Control................................................................................................................................... 60
USB Design ................................................................................................................................................................. 60
LoRaWAN Version 1.0.4 Changes ............................................................................................................................. 61
Pin Output Changes .................................................................................................................................................. 61
AT Command Additions and Modifications .............................................................................................................. 61
Summary of Contents for MultiConnect mDot MTDOT Series
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Page 45: ...DEVELOPER BOARD SCHEMATICS MultiConnect mDotTM MTDOT Developer Guide for Japan 45 Schematics...
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