MOTOROLA
Chapter 8. Package Description
8-5
Package Thermal Characteristics
8.3
Package Thermal Characteristics
Thermal values for the 256 pin MAPBGA are listed below in Table 8-1. The values listed
below assume the customer will be mounting the packages on a thermally enhanced mother
board. This is defined as a minimum 4-layer board with one ground plane. The values listed
below were measured in accordance with established JEDEC (Joint Electron Device
Engineering Council) standards.
8.4
MC92603Chip Pinout Listing
Table 8-2 list the MC92603signal to ball location mapping for the package. Also shown are
signaling direction (input or output), and the type of logic interface.
Table 8-1. MC92604 Package Thermal Resistance Values
Symbol
Description
256
MAPBGA
Units
θ
ja-0
Thermal resistance from junction to ambient, still air
33
θ
ja-2
Thermal resistance from junction to ambient, 200 LFM
1
1
Air flow in linear feet per minute
29
θ
ja-4
Thermal resistance from junction to ambient, 400 LFM
1
27
Table 8-2. MC92603 Signal to Ball Mapping
Signal Name
Description
Ball Number (256
MAPBGA)
Direction
I/O Type
XMIT_A_CLK
Transmitter A, Interface Clock
T9
Input
LVTTL
XMIT_A_0
Transmitter A, Data bit 0
T8
Input
LVTTL
XMIT_A_1
Transmitter A, Data bit 1
R8
Input
LVTTL
XMIT_A_2
Transmitter A, Data bit 2
P8
Input
LVTTL
XMIT_A_3
Transmitter A, Data bit 3
N8
Input
LVTTL
XMIT_A_4
Transmitter A, Data bit 4
M8
Input
LVTTL
XMIT_A_5
Transmitter A, Data bit 5
T7
Input
LVTTL
XMIT_A_6
Transmitter A, Data bit 6
R7
Input
LVTTL
XMIT_A_7
Transmitter A, Data bit 7
P7
Input
LVTTL
XMIT_A_K
Transmitter A, K
T6
Input
LVTTL
XMIT_A_ERR
Transmitter A, Force Code Error
R6
Input
LVTTL
XMIT_A_ENABLE
Transmitter A, Enable Data In
N7
Input
LVTTL
XCVR_A_DISABLE
Transceiver A, Disable
R9
Input
LVTTL
RECV_A_0
Receiver A, Data bit 0
L3
Output
LVTTL
RECV_A_1
Receiver A, Data bit 1
M2
Output
LVTTL
RECV_A_2
Receiver A, Data bit 2
K5
Output
LVTTL
C W
⁄
o
C W
⁄
o
C W
⁄
o
Summary of Contents for MC92603
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