DS50002569A-page 4
2017 Microchip Technology Inc.
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 31
A.2 Schematics and PCB Layout ....................................................................... 31
A.3 Board – Schematic ....................................................................................... 32
A.4 Board – Top Silk Layer ................................................................................ 33
A.5
Board
–
Top Copper and Silk Layer
......................................................... 34
A.6 Board – Top Copper .................................................................................... 35
A.7 Board – Bottom Copper Layer .................................................................... 36
A.8 Board – Bottom Copper and Silk Layer ....................................................... 37
A.9 Board – Bottom Silk Layer ........................................................................... 38
Worldwide Sales and Service .....................................................................................41
