Microchip Technology 10-Pin MSOP User Manual Download Page 25

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Installation and Operation



2017 Microchip Technology Inc.

DS50002569A-page 25

Table 2-5

shows other DACs that are compatible with this evaluation board.

TABLE 2-5:

SUPPORTED DIGITAL-TO ANALOG CONVERTERS

Device

MSOP-8

MSOP-10

Comments

MCP4801

—

MCP4802

—

MCP48FEB01

—

MCP48FEB02

—

MCP48FVB01

—

MCP48FVB02

—

MCP4901

—

TC1320

—

MCP4811

—

MCP4812

—

MCP48FEB11

—

MCP48FEB12

—

MCP48FVB11

—

MCP48FVB12

—

MCP4911

—

TC1321

-—

MCP4728

—

MCP4821

—

MCP4822

—

MCP48FEB21

—

MCP48FEB22

—

MCP48FVB21

—

MCP48FVB22

—

MCP4921

—

Summary of Contents for 10-Pin MSOP

Page 1: ... 2017 Microchip Technology Inc DS50002569A 10 Pin MSOP and 8 Pin MSOP Evaluation Board User s Guide ...

Page 2: ...eceived ISO TS 16949 2009 certification for its worldwide headquarters design and wafer fabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in California and India The Company s quality system processes and procedures are for its PIC MCUs and dsPIC DSCs KEELOQ code hopping devices Serial EEPROMs microperipherals nonvolatile memory and analog products In addition ...

Page 3: ...ntains 12 Chapter 2 Installation and Operation 2 1 Introduction 13 2 2 Getting Started 14 2 3 Hardware Description 16 2 4 10 Pin MSOP and 8 Pin MSOP Evaluation Board Description 19 2 4 1 Power and Ground 19 2 4 2 PCB Pads 19 2 4 3 Passive Components RUx RDx RSx C1 and C2 20 2 4 4 Multiplexing Resistor R1 20 2 4 5 Device Footprints 21 2 4 6 PICkit Serial or In Circuit Serial Programming ICSP Interf...

Page 4: ...uction 31 A 2 Schematics and PCB Layout 31 A 3 Board Schematic 32 A 4 Board Top Silk Layer 33 A 5 Board Top Copper and Silk Layer 34 A 6 Board Top Copper 35 A 7 Board Bottom Copper Layer 36 A 8 Board Bottom Copper and Silk Layer 37 A 9 Board Bottom Silk Layer 38 Worldwide Sales and Service 41 ...

Page 5: ...t evaluation tool complies with EU RoHS2 Directive 2011 65 EU This development evaluation tool when incorporating wireless and radio telecom functionality is in compliance with the essential requirement and other relevant provisions of the R TTE Directive 1999 5 EC and the FCC rules as stated in the declaration of conformity provided in the module datasheet and the module product page available at...

Page 6: ...10 Pin MSOP and 8 Pin MSOP Evaluation Board User s Guide DS50002569A page 4 2017 Microchip Technology Inc NOTES ...

Page 7: ...et started with this evaluation board Appendix A Schematic and Layouts Shows the schematic and layout diagrams for 10 Pin MSOP and 8 Pin MSOP Evaluation Board NOTICE TO CUSTOMERS All documentation becomes dated and this manual is no exception Microchip tools and documentation are constantly evolving to meet customer needs so some actual dialogs and or tool descriptions may differ from those in thi...

Page 8: ... dialog button Click OK A tab Click the Power tab N Rnnnn A number in verilog format where N is the total number of digits R is the radix and n is a digit 4 b0010 2 hF1 Text in angle brackets A key on the keyboard Press Enter F1 Courier New font Plain Courier New Sample source code define START Filenames autoexec bat File paths c mcc18 h Keywords _asm _endasm static Command line options Opa Opa Bi...

Page 9: ...plication notes and sample programs design resources user s guides and hardware support documents latest software releases and archived software General Technical Support Frequently Asked Questions FAQs technical support requests online discussion groups Microchip consultant program member listing Business of Microchip Product selector and ordering guides latest Microchip press releases listing of...

Page 10: ...Preface 2017 Microchip Technology Inc DS50002569A page 10 NOTES ...

Page 11: ...P Evaluation Board Features What the 10 Pin MSOP and 8 Pin MSOP Evaluation Board Kit Contains 1 2 WHAT IS THE 10 PIN MSOP AND 8 PIN MSOP EVALUATION BOARD The 10 Pin MSOP and 8 Pin MSOP Evaluation Board Figure 1 1 is a bond out board that allows the system designer to quickly evaluate the operation of Microchip Technology s devices in any of the following packages MSOP 8 and 10 pin DIP 10 pin FIGUR...

Page 12: ...lk screen area to write specifics of implemented circuit on back of PCB such as MCP48FEB22 E UN PICkitTM Serial Analyzer and or PICkit Programming ICSPTM Header Crystal ceramic resonator circuit footprints SMT and THT Second 1 x 6 in line connector header for interfacing to boards with PICkit Serial Analyzer header Some of the Microchip family of devices that can be evaluated in the PCB include Di...

Page 13: ...valuate a minimum configuration for the device It also allows the device to easily be jumpered into an existing system The board also has two 6 pin headers 1 x 6 whose signals can easily be jumpered to any of the device s pins This allows one header to be connected for one purpose programming and the other for communication to another board An example would be installing a PIC12F1572 MSOP 8 in one...

Page 14: ...on to the MSOP 10 package For example pin 1 is connected to RU1 RD1 and RS1 This circuit allows each pin to individually have any of the following a pull up resistor a pull down resistor or a loading filtering capacitor and a series resistor Power supply filtering capacitors are connected between the VDD and VSS pads C1 and C2 The circuit has two 6 pin headers that can be used for PICkit Serial co...

Page 15: ...hip Technology Inc DS50002569A page 15 Figure 2 1 shows the evaluation board circuit and an example of connecting signals from the J1 header to the device pins with jumper wire FIGURE 2 1 10 Pin MSOP and 8 Pin MSOP Evaluation Board Circuit ...

Page 16: ...logy Inc 2 3 HARDWARE DESCRIPTION Figure 2 2 and Figure 2 3 show the top side and bottom side of the component layout of the 10 Pin MSOP and 8 Pin MSOP Evaluation Board FIGURE 2 2 10 Pin MSOP and 8 Pin MSOP Evaluation Board Top View FIGURE 2 3 10 Pin MSOP and 8 Pin MSOP Evaluation Board Bottom View ...

Page 17: ...nd the pull down resistor is RDx The X is a numeric value that corresponds to a partic ular pad 1 to 8 As an example Pad 5 s pull up resistor is RU5 Capacitor C1 and C2 are the power supply filtering capacitors For whichever pin is the device s VDD the RDx component footprint can be used for the device s bypass capacitor Table 2 1 describes the components Two 6 pin header interfaces are available ...

Page 18: ...en using a PIC MCU placing a resistor in the RSx and a capacitor in the RDx locations creates a low pass filter which can be used to generate a variable output voltage if connected to a PWM capable pin R1 Used in case of devices that have multiplexed SDI SDO pins for example the MCP45x1 Y1 Used to generate a clock signal J1 PICkit Serial ICSP header J2 Generic 6 pin header used to connect two eval...

Page 19: ...round plane to RDx components 2 4 2 PCB Pads For each package pin pins 1 to 10 there is a PCB pad pads 1 to 10 The device has power pins VDD and ground pins VSS To ease connections on the PCB vias to the power and ground plane have been installed close to each PCB pad This allows any pad to be connected to the power or ground plane so when power is connected to the VDD and VSS pads it is also conn...

Page 20: ...ts that should be used when evaluating that device Component RUx allows a pull up resistor to be installed for the device pin Component RDx allows a pull down resistor or a a capacitive load filter to be installed for the device pin Component RSx allows a series component to be fitted Component C1 and C2 allows power supply filtering capacitors to be installed 2 4 4 Multiplexing Resistor R1 Due to...

Page 21: ...OP footprint has been laid out for packages that have a typical pitch of 0 65 mm BSC a maximum lead width of 0 4mm and a maximum molded package width of 3 mm BSC Eight lead MSOP packages that meet these characteristics should be able to be used with this board 2 4 5 3 DIP 10 The 10 pin DIP footprint has been laid out for packages that have a typical pitch of 100 mil BSC a maximum lead width of 22 ...

Page 22: ...op layer silk screen indicates the common PICkit Serial signal names while the bottom layer silk screen indicates the ICSP signal names FIGURE 2 8 PICkit Serial ICSP Interface Connections 2 4 6 1 PICKIT SERIAL INTERFACE Table 2 3 shows the pin number assignment for the different signals for each of the supported interface protocols SPI I2 C and others TABLE 2 3 PICKIT SERIAL HEADER SIGNALS Pin Num...

Page 23: ...d interconnect header Header J2 Figure 2 9 shows the interface connection of J2 Header This header allows two ADM00309 boards to be inter connected which permits a microcontroller from one of the boards to be used as a controller for the device on the second board The six connector signals are routed out to six holes which should be wired to the appropriate pins FIGURE 2 9 J2 Header Connections TA...

Page 24: ...internal band gap voltage When VDD is selected VDD is connected internally to the DAC reference circuit When the VREF pin is used the output buffer s gain to can be selected to be 1x or 2x When the gain is 2x the VREF pin voltage should be limited to a maximum of VDD 2 Figure 2 10 shows the pinouts of the MCP48FEBXX family FIGURE 2 10 MCP48FEBXX Family Pinout Figure 2 11 represents PICkit Serial I...

Page 25: ...TABLE 2 5 SUPPORTED DIGITAL TO ANALOG CONVERTERS Device MSOP 8 MSOP 10 Comments MCP4801 Y MCP4802 Y MCP48FEB01 Y MCP48FEB02 Y MCP48FVB01 Y MCP48FVB02 Y MCP4901 Y TC1320 Y MCP4811 Y MCP4812 Y MCP48FEB11 Y MCP48FEB12 Y MCP48FVB11 Y MCP48FVB12 Y MCP4911 Y TC1321 Y MCP4728 Y MCP4821 Y MCP4822 Y MCP48FEB21 Y MCP48FEB22 Y MCP48FVB21 Y MCP48FVB22 Y MCP4921 Y ...

Page 26: ...face with speeds of 100 kHz 400 kHz and 3 4 MHz The PICkit Serial Analyzer can be used to communicate with the devices The proper connections are being shown in Figure 2 13 Other Digital Potentiometers that are supported by this evaluation board are shown in Table 2 6 FIGURE 2 12 MCP45x1 Family Pinout FIGURE 2 13 MCP45x1 PICkit Serial Header Example Connections Required Jumpers for PICkit Serial o...

Page 27: ...1572 is a nanowatt XLP PIC Microcontroller that is offered in an 8 lead MSOP package This device can be installed on the top side of the PCB Figure 2 14 shows the PIC12F1572 s pin out while Figure 2 15 shows an example connection for the ICSP interface and the connection of the crystal circuit to the secondary oscillator FIGURE 2 14 PIC12F1572 Pinout ...

Page 28: ... Pin MSOP Evaluation Board User s Guide DS50002569A page 28 2017 Microchip Technology Inc FIGURE 2 15 PIC12F1572 ICP Header Example Connections Bottom View FIGURE 2 16 PIC12F1572 ICP Header Example Connections Top View ...

Page 29: ...le 2 7 TABLE 2 7 SUPPORTED MSOP 8 PIC MICROCONTROLLERS Device Family Core Comments PIC12F508 Baseline 8 bit PIC12F509 Baseline 8 bit PIC12F510 Baseline 8 bit PIC12F609 Mid Range 8 bit PIC12F615 Mid Range 8 bit PIC12F1501 Enhanced Mid Range PIC12F1571 Enhanced Mid Range PIC12F1572 Enhanced Mid Range PIC12F617 Mid Range 8 bit PIC12F519 Baseline 8 bit PIC12LF1552 Mid Range 8 bit ...

Page 30: ...n order to obtain a functional system One board hosts a PIC12Fxxxx which is programmed using a PicKIT3 connected to J1 and controls a second board which has a MCP48FEB22 E UN device installed The J2 connector of the PIC board is used as a serial communication port being connected to J1 of the DAC board FIGURE 2 17 Creating a Two Board Evaluation System PIC DAC Appropriate headers fitted 0 0 0 0 0 ...

Page 31: ...Installation and Operation 2017 Microchip Technology Inc DS50002569A page 31 NOTES ...

Page 32: ...10 Pin MSOP and 8 Pin MSOP Evaluation Board User s Guide DS50002569A page 32 2017 Microchip Technology Inc ...

Page 33: ...oard Top Silk Layer Board Top Copper and Silk Layer Board Top Copper Board Bottom Copper Layer Board Bottom Copper and Silk Layer A 2 SCHEMATICS AND PCB LAYOUT Section A 3 Board Schematic shows the schematic of the 10 Pin MSOP and 8 Pin MSOP Evaluation Board Section A 4 Board Top Silk Layer shows the layout for the top layer of the 10 Pin MSOP and 8 Pin MSOP Evaluation Board The layer order is sho...

Page 34: ...PD04 PD05 PD10 PD09 PD08 PD07 PD06 PAD01 PAD02 PAD03 PAD04 PAD05 PAD06 PAD07 PAD08 PAD09 PAD10 1 2 3 4 5 DIP10_A J11 1 2 3 4 5 DIP10_B J12 RU1 RD1 VSS RS2 P02 1 1 VDD PAD02 RU2 RD2 VSS RS3 P03 1 1 VDD PAD03 RU3 RD3 VSS RS4 P04 1 1 VDD PAD04 RU4 RD4 VSS RS5 P05 1 1 VDD PAD05 RU5 RD5 VSS RS10 P10 1 1 VDD PAD10 RU10 RD10 VSS RS9 P09 1 1 VDD PAD09 RU9 RD9 VSS RS8 P08 1 1 VDD PAD08 RU8 RD8 VSS RS7 P07 ...

Page 35: ...Schematic and Layouts 2017 Microchip Technology Inc DS50002569A page 35 A 4 BOARD TOP SILK LAYER ...

Page 36: ...10 Pin MSOP and 8 Pin MSOP Evaluation Board DS50002569A page 36 2017 Microchip Technology Inc A 5 BOARD TOP COPPER AND SILK LAYER ...

Page 37: ...Schematic and Layouts 2017 Microchip Technology Inc DS50002569A page 37 A 6 BOARD TOP COPPER ...

Page 38: ...10 Pin MSOP and 8 Pin MSOP Evaluation Board DS50002569A page 38 2017 Microchip Technology Inc A 7 BOARD BOTTOM COPPER LAYER ...

Page 39: ...Schematic and Layouts 2017 Microchip Technology Inc DS50002569A page 39 A 8 BOARD BOTTOM COPPER AND SILK LAYER ...

Page 40: ...10 Pin MSOP and 8 Pin MSOP Evaluation Board DS50002569A page 40 2017 Microchip Technology Inc A 9 BOARD BOTTOM SILK LAYER ...

Page 41: ...27 5980 5118 China Xian Tel 86 29 8833 7252 Fax 86 29 8833 7256 ASIA PACIFIC China Xiamen Tel 86 592 2388138 Fax 86 592 2388130 China Zhuhai Tel 86 756 3210040 Fax 86 756 3210049 India Bangalore Tel 91 80 3090 4444 Fax 91 80 3090 4123 India New Delhi Tel 91 11 4160 8631 Fax 91 11 4160 8632 India Pune Tel 91 20 3019 1500 Japan Osaka Tel 81 6 6152 7160 Fax 81 6 6152 9310 Japan Tokyo Tel 81 3 6880 37...

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