Installation and Operation
2017 Microchip Technology Inc.
DS50002569A-page 21
2.4.5
Device Footprints
This section describes the characteristics of the component footprints so that you are
better able to determine if the desired component(s) are compatible with the board.
2.4.5.1
MSOP-10
The 10-pin MSOP footprint has been laid out for packages that have a typical pitch of
0.50 BSC, a maximum lead width of 0.41 mm, and a maximum molded package width
of 3 BSC. Ten-lead (or less) MSOP packages that meet these characteristics should be
able to be used with this board.
2.4.5.2
MSOP-8
The 8-pin MSOP footprint has been laid out for packages that have a typical pitch of
0.65 mm (BSC), a maximum lead width of 0.4mm, and a maximum molded package
width of 3 mm BSC. Eight-lead MSOP packages that meet these characteristics should
be able to be used with this board.
2.4.5.3
DIP-10
The 10-pin DIP footprint has been laid out for packages that have a typical pitch of
100 mil (BSC), a maximum lead width of 22 mil and a molded package width of 600 mil.
2.4.5.4
PASSIVE COMPONENTS
All passive components (R1, RUx, RDx, RSx and Cx) use a surface mount [0805] foot-
print. Any component that has a compatible footprint can be used with this board.
2.4.5.5
HEADERS (1 X 6)
The headers have a typical pitch of 100 mil (BSC). The headers are designed to be
compatible with the PICkit Serial Analyzer and PICkit 3 Programmer.
