Installation and Operation
2017 Microchip Technology Inc.
DS50002569A-page 17
The 10-Pin MSOP and 8-Pin MSOP Evaluation Board is a four-layer board
(62 mm x 48 mm). There are ten connection points/pads that can use either
through-hole or surface-mount connector posts.
The pad labeled V
DD
is connected to the PCB power plane, while the pad labeled V
SS
is connected to the PCB ground plane. All the passive components that are connected
to V
DD
or V
SS
are connected to either the power plane or ground plane. The 10 remain-
ing PCB pads correspond to the device pins (e.g., pad 1 connects to pin1).
Each pad has three passive components associated with them: a pull-up resistor, a
pull-down resistor and an in line series resistor. The pull-up resistor is always RUx and
the pull-down resistor is RDx. The “X” is a numeric value that corresponds to a partic-
ular pad (1 to 8). As an example, Pad 5’s pull-up resistor is RU5. Capacitor C1 and C2
are the power supply filtering capacitors. For whichever pin is the device’s V
DD
, the
RDx component footprint can be used for the device’s bypass capacitor.
describes the components.
Two 6-pin header interfaces are available (J1 and J2). Header J1 will typically be used
for the PICkit Serial or the PIC In-Circuit Serial Programming (ICSP) interface. Header
J2 allows a custom interface for connecting to other boards (see
).
For additional information, refer to
Section 2.4.6 “PICkit Serial or In-Circuit Serial
Programming (ICSP) Interface (Header J1)”
shows an example of a Con-
nection between two boards, one acting as a controller for the second one, which con-
tains the device to be evaluated. Not all connections are illustrated.
FIGURE 2-4:
Example of Two PCB System.
