Linear Technology Analog Devices LTM4636-1, Manual, Page: 35 / 36

LTM4636
35
4636f
For more information www.linear.com/LTM4636
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
Please refer to http://www.linear.com/product/LTM4636#packaging for the most recent package drawings.
4
PIN “A1” CORNER
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS. DRA
WING NOT TO SCALE
BALL DESIGNA
TION PER JEP95
4 3
DET
AILS OF PIN #1 IDENTIFIER ARE OP
TIONAL,
BUT MUST BE LOCA
TED WITHIN THE ZONE INDICA
TED.
THE PIN #1 IDENTIFIER MA
Y BE EITHER A MOLD OR
MARKED FEA
TURE
PACKAGE TOP VIEW
X
Y
aaa Z
aaa Z
PACKAGE BOT
TOM VIEW
3
SEE NOTES
SUGGESTED PCB LA
YOUT
TOP VIEW
BGA 144 1016 REV D
TRA
Y PIN 1 BEVEL
PACKAGE IN TRA
Y LOADING ORIENT
ATION
COMPONENT
PIN “A1”
DET
AIL A
PIN 1
0.0000
0.0000
DET
AIL A
Øb (144 PLACES)
D
(3.0)
(2.4
)
(2.4
)
A
DET
AIL B
PACKAGE SIDE VIEW
Z
Z
M
X
Y
Z
ddd
M
Z
eee
0.630 ±0.025 Ø 144x
E
b
e
e
b
A2
F
G
BGA Package
144-Lead (16mm
×
16mm
×
7.07mm)
(Reference LTC DWG # 05-08-1937 Rev D)
0.6350 0.6350 1.9050 1.9050 3.1750 3.1750 4.4450 4.4450 5.7150 5.7150 6.9850
6.9850
6.9850
5.7150
5.7150
4.4450
4.4450
3.1750
3.1750
1.9050
1.9050
0.6350
0.6350
6.9850
G F E A B D C H M L K J
2
1
4
3
5
6
7
12
8
9
10
11
7
SEE NOTES
DET
AIL B
SUBSTRA
TE
A1
ccc Z
// bbb Z
H2
H1
H3
SYMBOL
A
A1 A2
b
b1
D
E e F
G
H1 H2 H3
aaa
bbb
ccc
ddd
eee
MIN 6.57 0.50 2.31 0.60 0.60 0.36 1.95 3.76
NOM
7.07 0.60 2.41 0.75 0.63
16.00 16.00
1.27
13.97 13.97
0.41 2.00 4.06
MAX
7.42 0.70 2.51 0.90 0.66 0.46 2.05 4.21 0.15 0.10 0.20 0.30 0.15
NOTES BALL HT BALL DIMENSION PAD DIMENSION SUBSTRA
TE THK
MOLD CAP HT INDUCTOR HT
DIMENSIONS
TOT
AL NUMBER OF BALLS: 144
EPOXY/SOLDER
(11.20)
(10.0)
(3.0)
µModule
5. PRIMAR
Y DA
TUM -Z- IS SEA
TING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
7
PACKAGE ROW AND COLUMN LABELING MA
Y V
AR
Y
AMONG µModule PRODUCTS. REVIEW EACH P
ACKAGE
LA
YOUT CAREFULL
Y
!
b1
MOLD CAP