
LTM4636
2
4636f
absoluTe MaxiMuM raTings
V
IN
, SW, HZBREG, RUNP ........................... –0.3V to 16V
V
OUT
.......................................................... –0.3V to 3.5V
PGOOD, RUNC, TMON, PV
CC
, MODE/PLLIN, PHMODE,
FREQ, TRACK/SS, TEST1, TEST2, V
OUTS1
–
, V
OUTS1
+
,
SNSP1, SNSP2, TEST3, TEST4 .....–0.3V to INTV
CC
(5V)
V
FB
, COMPA, COMPB (Note 7) .................. –0.3V to 2.7V
PV
CC
Additional Output Current ................0mA to 50mA
(Note 1)
pin conFiguraTion
1
M
L
K
J
H
G
F
E
D
C
B
A
TOP VIEW
BGA PACKAGE
144-LEAD (16mm
×
16mm
×
7.07mm)
V
OUT
GND
GND
GND
GND
SW
V
IN
2
3
4
5
6
7
8
9
10 11 12
PGOOD
RUNC
SNSP2
SNSP1
COMPB
TEST2
TEST4 (FLOAT PIN)
INTV
CC
TEMP
–
TEMP
+
CLKOUT
SGND
V
FB
V
OUTS1
+
HIZREG
TRACK/SS
COMPA
V
OUTS1
–
FREQ
PWM
TEST3
MODE/PLLIN
TEST1
TMON
NC
GMON
PHASMD
RUNP
PV
CC
T
JMAX
= 125°C,
θ
JA
= 7.5°C/W,
θ
JCbottom
= 3°C/W,
θ
JCtop
= 15°C/W,
θ
JBA
= 12°C/W
θ
JA
= DERIVED FROM 95mm
×
76mm PCB WITH 6 LAYERS, WEIGHT = 3.95g
θ
VALUES DETERMINED PER JESD51-12
Note:
θ
JA
= (
θ
JCbottom
+
θ
JBA
)||
θ
JCtop
;
θ
JBA
is Board to Ambient
TEMP
+
, TEMP
–
.......................................... –0.3V to 0.8V
INTV
CC
Peak Output Current (Note 6) ....................20mA
Internal Operating Temperature Range
(Note 2) .................................................. –40°C to 125°C
Storage Temperature Range .................. –55°C to 125°C
Reflow (Peak Body) Temperature .......................... 250°C
orDer inForMaTion
http://www.linear.com/product/LTM4636#orderinfo
Note: PWM, CLKOUT, and GMON are outputs only.
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(SEE NOTE 2)
DEVICE
FINISH CODE
LTM4636EY#PBF
SAC305 (RoHS)
LTM4636
BGA
–40°C to 125°C
LTM4636IY#PBF
–40°C to 125°C
•
Device temperature grade is indicated by a label on the shipping
container.
•
Pad or ball finish code is per IPC/JEDEC J-STD-609.
•
Terminal Finish Part Marking:
•
This product is not recommended for second side reflow. For more
information, go to
•
Recommended BGA PCB Assembly and Manufacturing Procedures:
•
BGA Package and Tray Drawings:
•
This product is moisture sensitive. For more information, go to: