Page 38 Operating Manual Leica EM TXP 10/10
Flatten the surface of the SEM stub or rod using the tungsten carbide miller.
The prepared surface is perpendicular to the tool axis.
Remove the holder (keep in mind the orientation of the holder).
Glue the sample with the polished side down onto the surface of the rod. In
this case “crystal bond” wax was used. Make sure that the side of the stub or
rod is not covered with a layer of glue
Insert sample into the instrument
Insert disc cutter and advance the disc cutter until the front face of the disc
cutter gently touches the “glue free” part of the stub or rod.
Clear the advance indication.
Retract the spindle to the desired value (in this case 80µm) and cut the
sample through.
Exchange disc cutter with the polishing inserts (9µm, 6µm, 3µm, and 1µm
(and 0.5µm). Polish down the sample until the desired value is indicated.
Take into account the layer thickness of the glue which reduces the actual
thickness of the sample. Use the HOLD function when replacing the tool
(foils)
20µm slice of a gold wire bonding on IC with conductive layers
