Page 35 Operating Manual Leica EM TXP 10/10
The instrument will now perform continuous cycles. The Spindle will retract 10µm at
the end position of the cutting window and will advance 10µm + the selected step
size at the start position of the cutting window. This process should continue until the
marks from the former process are removed. You may interrupt the process at any
time by pressing the START button once and the instrument will finish the cycle, or
twice and the instrument will stop immediately.
By swivelling the specimen pivot arm to the front face position (60° indication) the
surface can be investigated. Once the sample shows uniform surface the next foil
with a finer grade should be used by replacing the insert. The arbor stays in the
spindle.
If the target is hidden (e.g. gold wire bonding in a IC package) after sawing
through the sample you may approach towards the target using the disc cutter
in the auto run mode with a step size of 10µm. As soon as the gold wire
becomes visible change, to the 9µ diamond foil followed by 6µm, 3µm and 1µm
(if necessary to 0.5µm as well).
