9.2 Example
results
PCB - through hole:
Processed as described on previous pages using
9µm, 6µm, 3µm and 1µm diamond polishing foils.
Gold wire bonding on IC package:
Processed as described on previous pages.
Target approach was carried out by using the
diamond disc cutter. Alignment was performed
using the angle adjustment adapter 16702830.
The sample was ground with 15µm, 9µm, 5µm SiC
lapping foils subsequently polished with 3µm, 1µm
and 0.25µm diamond paste on neoprene cloth.
Bolted joint (watch parts):
Non-embedded parts were clamped in the AFM
insert. Grinding and polishing has been performed
with 9µm, 6µm, 3µm, 1µm diamond foils (LA-type)
Polymer cord from a tyre:
Sample was embedded (for support). The surface
was smoothed with a diamond miller at 20 000 rpm
(cooled with water) prior to a 3µm and 1µm
aluminium oxide foil polishing process.
Page 36 Operating Manual Leica EM TXP 10/10
