Page 34 Operating Manual Leica EM TXP 10/10
Target cut with the diamond-cutting wheel:
To achieve a higher surface quality an automatic E-W movement of the tooling
spindle is recommended.
Swivel the specimen pivot arm in the 0° processing position to its end stop
(chapter 7.5.)
Clear advance indication (chapter 5)
Retract the spindle 10µm using feed hand wheel (2).
Set the cutting window (chapter 6.7)
Advance the disc cutter to the measured position using the feed hand wheel
or FORW button. Reduce the amount removed to allow for grinding and
polishing after cutting.
Switch on the instrument by pressing the START button. Once the end
position is reached, the spindle retracts 10µm and moves to the start position.
An advance of 10µm will be performed afterwards
Cross polishing to the target:
Slide in lever for auto E-W movement (7.1)
Swivel specimen pivot arm to the 0° processing position
Remove diamond disc cutter
Insert arbor for polishing foil carrier (chapter 4.7.)
Screw into the carrier with the 9µm diamond polishing foil
Retract spindle until the foil misses the sample
Set speed to ~ 2200 rpm (chapter 6.1)
Switch on the spindle motor and align water stream of the spout
Activate the force measuring mode by pressing F button (chapter 6.6.)
Select a step size of 10µm or 1µm for fragile samples (chapter 6.5.)
Advance with the feed hand wheel until the F values changes or you hear a
contact noise.
Retract the spindle about 10µm
Set the cutting window (chapter 6.7.) Start point in overlapping position
Select 1µm step advance
Press START button longer than one second (AUTO LED is on)
