Lattice Semiconductor iCE40 UltraPlus, User Manual

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iCE40 UltraPlus Mobile Development Platform
Evaluation Board User Guide
© 2017-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal .
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-EB-02007-1.1 5
2. Features
The iCE40 UltraPlus Mobile Development Platform development kit includes the items below.

iCE40 UltraPlus Mobile Development Platform– PCB, case, and integrated Li-ion battery featuring:

Four iCE40 UltraPlus devices (U1-U4 iCE5UP5K-WLCSP30) in 30-Ball WLCSP packages

Large capacity of onboard SPI Flash memory (U37 Micron M25P80 8Mb) to store the FPGA demo bitstream for
all four iCE40 UltraPlus devices

Example of a PCB design using 0.40 mm Ball Pitch package

Control switches to select which of the four devices is active (only one device is active at a time)

Standard USB cable for device programming (Lattice part number HW-USBN-2A, HW-USBN-2B or equivalent)

RoHS-compliant packaging and process

Key Components

iCE40UP5K-30WLCSP (4 pieces)

Power Regulation

Bluetooth module

MIPI LCD Mobile Display (1.54 inch 240 x 240 RGB LH154Q01)

Camera image sensor OVM7692 VGA 640 x 480 (CSI and parallel video interface option)

Microphones (Dual I2S and Dual PDM microphones with audio amp, connectors for 3.5 mm and expansion)

RGB LED

Sensors that include:
–
Barometric pressure sensor
– Compass sensor
– 3D accelerometer and 3D gyroscope sensor
– Three-axis linear accelerometer sensor

Pre-loaded Demo – The kit includes a pre-loaded MIPI LCD Mobile Display demo.

USB Connector Cable – A mini-B USB port provides power, a programming interface and communication channel
for a PC to communicate directly to iCE40 devices.