Lattice Semiconductor iCE40 UltraPlus, User Manual

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Lattice Semiconductor iCE40 UltraPlus User Manual Download Page 4

iCE40 UltraPlus Mobile Development Platform
Evaluation Board User Guide

© 2017-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at

www.latticesemi.com/legal

.

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

4

FPGA-EB-02007-1.1

1.

Introduction

Thank you for choosing the Lattice iCE40 UltraPlus™ Mobile Development Platform (MDP) Board.

This MDP board is an easy-to-use platform for demonstrating various features of the iCE40 UltraPlus for mobile
applications. The MDP form-factor is similar to a mobile device (cell phone), with various sensors, display, Bluetooth
communication, and others. The board contains four individual iCE40 UltraPlus devices, each configured with a unique
set of interfaces to support multiple demonstrations.

Features that can be demonstrated using this board include:



Mobile Display (Onboard 1.54 inch 240 x 240 RGB wearable type display with MIPI DSI interface)



Camera (Onboard VGA 640 x 480 sensor with CSI and parallel video interface option)



Image and facial recognition



Microphones (Onboard Dual I2S and Dual PDM microphones with audio amp, 3.5 mm and expansion connectors)



Voice recognition



Audio beam forming capabilities



Sensors (Various Mobile Type Sensors with expansion connector)



RGB LED



Pressure Sensor



Compass Sensor



Gyroscope Sensor



Accelerometer Sensor

This guide describes how to begin using the MDP. The contents of this user guide include top-level functional
descriptions of the various portions of the evaluation board, a summary of demonstrations, descriptions of the
onboard connectors, switches, jumpers, configuration options, along with a complete set of schematics and the bill of
materials.

Note:

Static electricity can severely shorten the lifespan of electronic components. Be careful
to follow proper ESD prevention handling standards when handling and using the
iCE40 UltraPlus Mobile Development Platform Board.

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Summary of Contents for iCE40 UltraPlus

Page 1: ...iCE40 UltraPlus Mobile Development Platform Evaluation Board User Guide FPGA EB 02007 Version 1 1 April 2018 ...

Page 2: ... 5 Software Requirements 10 6 Demonstrations 11 6 1 Mobile Display Demonstration on U1 11 6 2 Audio Microphone Demonstrations on U2 11 6 3 RGB LED Demonstration on U3 11 6 4 Sensor Demonstrations on U3 12 6 5 Face Recognition Demonstration on U4 12 7 Board Configuration and Programming 14 7 1 Jumpers and Switches 14 7 2 Programming the iCE40 Devices Configuration Memory CRAM 17 7 3 Programming Onb...

Page 3: ...us MDP Board 9 Figure 6 1 Rework Resistor Positions Described in Parallel Video Bus Configuration 13 Figure 7 1 Board Configuration for Programming iCE40 UltraPlus Device UI 15 Figure 7 2 Programming iCE40 Devices on Board 17 Figure 7 3 Programming SPI Flash on Board 18 Figure A 1 Block Diagram 22 Figure A 2 iCE40UP5K FPGA A Display 23 Figure A 3 iCE40UP5K FPGA B Audio 24 Figure A 4 iCE40UP5K FPGA...

Page 4: ... Features that can be demonstrated using this board include Mobile Display Onboard 1 54 inch 240 x 240 RGB wearable type display with MIPI DSI interface Camera Onboard VGA 640 x 480 sensor with CSI and parallel video interface option Image and facial recognition Microphones Onboard Dual I2S and Dual PDM microphones with audio amp 3 5 mm and expansion connectors Voice recognition Audio beam forming...

Page 5: ...iCE40 UltraPlus devices Example of a PCB design using 0 40 mm Ball Pitch package Control switches to select which of the four devices is active only one device is active at a time Standard USB cable for device programming Lattice part number HW USBN 2A HW USBN 2B or equivalent RoHS compliant packaging and process Key Components iCE40UP5K 30WLCSP 4 pieces Power Regulation Bluetooth module MIPI LCD ...

Page 6: ...ge without notice 6 FPGA EB 02007 1 1 Figure 2 1 shows the top side while Figure 2 2 on the next page shows the bottom side of the iCE40 UltraPlus Mobile Development Platform Board indicating the specific features that are designed on the board J2 MIPI LCD Display Connector U1 iCE40UP5K Display Demo J19 Program iCE40 or Flash D13 RGB LED SW2 Power SW J5 Power Supply and Programming J34 Analog Audi...

Page 7: ...mes are trademarks or registered trademarks of their respective holders The specifications and information herein are subject to change without notice FPGA EB 02007 1 1 7 Battery U94 19 I2S Microphones U9 FTDI USB to SPI U37 SPI Flash U43 Audio DAC I2S to Analog U2 iCE40UP5K Audio Demo U95 12 I2S Microphones U3 iCE40UP5K Sensor Demo U35 22 36 38 Various Sensors in Sensor Demo Figure 2 2 iCE40 Ultr...

Page 8: ...Y 4 2 V POWER SWITCH VREG 3 3 V VREG 2 5 V VREG 1 2 V 1 8 V VREG 1 5 V 2 8 V VREG 1 8 V 3 0 V FLASH BLE GYRO FGDI VREG LED BACKLIGHT FPGAs VPP2V5 FPGAs VCC FPGAs VCCIO CAMERA SENSOR OVM7692 DISPLAY DIODES 3 3 V 2 5 V 1 2 V 1 8 V 1 5 V 2 8 V 1 8 V 3 0 V Figure 3 1 Power Block Diagram 3 2 Current Measurement Test Points Each of the four FPGAs have six 1 Ω resistors in series with their power inputs ...

Page 9: ...is board depending on the J23 settings There are six devices sharing the same clock source that are available at the same time These include four iCE40UP5K U1 U4 devices that are responsible for various demos U43 which is a stereo audio DAC with direct drive headphone amplifier and U39 which is an ultra compact size 640 x 480 image sensor Short Pins 2 3 leads the onboard 27 MHz clock to these devi...

Page 10: ...s and information herein are subject to change without notice 10 FPGA EB 02007 1 1 5 Software Requirements Install the following software before you begin developing designs for the board Lattice iCEcube2 2017 01 or higher Used for developing your own custom designs for the iCE40 UltraPlus FPGA Diamond Programmer 3 8 or higher Used to program the iCE40 UltraPlus FPGA These software programsare ava...

Page 11: ...amaged 6 2 Audio Microphone Demonstrations on U2 FPGA U2 is optimized for microphone related demonstrations such as audio beam The board contains two I2S microphones two PDM microphones a 3 5 mm audio jack driven by a MAX9850 headphone audio amplifier and an expansion connector allowing up to seven microphones used in an array This demo shows the capability of picking up human voice and driving th...

Page 12: ...30WLCSP U22 Digital barometric pressure sensor U35 High performance e compass 3D accelerometer and 3D magnetometer U36 3D accelerometer and 3D gyroscope U38 3 axis pico accelerometer 6 5 Face Recognition Demonstration on U4 This demo showcases the capability of ICE40 UltraPlus to detect and react to a general human face Key components for this demo include U4 iCE40UP5K 30WLCSP U39 Image Sensor OVM...

Page 13: ...ive holders The specifications and information herein are subject to change without notice FPGA EB 02007 1 1 13 Figure 6 1 shows the resistors of the rework Resistors highlighted in red rectangle need to be removed resistors highlighted in green rectangle need to install 0 Ω resistors blue highlights show the resistors needing installation verification J23 U14 Xtal U4 iCE40 U39 OVM7692 U16 Camera ...

Page 14: ...25 To program the iCE40 UltraPlus device U2 short pins 1 2 To program any other device on the board short pins 11 12 Note Follow the silkscreen markings on the board pins 1 2 are at the bottom of this header bank J26 To program the iCE40 UltraPlus device U3 short pins 1 2 To program any other device on the board short pins 9 10 Note Follow the silkscreen markings on the board pins 1 2 are at the b...

Page 15: ... recommended that the BLE module be removed from the SPI bus when the module is not in demo use Figure 7 1 shows the setting of jumpers and switches while trying to program iCE40 device U1 directly J17 Short pins 1 2 programming iCE40 device UI SW2 Slide on to power on board J5 Power Supply and Programming J25 Short pins 11 12 J17 Short pins 1 2 programming iCE40 device UI J19 Put jumpers horizont...

Page 16: ...rks or registered trademarks of their respective holders The specifications and information herein are subject to change without notice 16 FPGA EB 02007 1 1 Table 7 2 iCE40 UltraPlus Device Selection Summary SPI Flash Demux CRESET Boot Control Jumper Placement Section iCE40 UltraPlus RefDes SW5 2 1 J17 J25 J26 J27 Camera U1 OFF OFF 1 2 11 12 9 10 9 10 Audio U2 OFF ON 9 10 1 2 9 10 9 10 Sensor RGB ...

Page 17: ...ct the iCE40 UltraPlus Mobile Development Platform board via the USB cable to a PC or MAC 5 Start Diamond Programmer 6 Set Device Family to iCE40 UltraPlus and Device to iCE40UP5K Refer Figure 7 2 below 7 Be sure to perform the Program Verify operation If you select only the Program operation you may get a false positive that the device has programmed 8 Field Programming Speed Settings should be s...

Page 18: ... iCE40 UltraPlus and Device to iCE40UP5K 5 Be sure to do the Program Verify operation If you select only the Program operation you may get a false positive that the device has programmed 6 Field Programming Speed Settings should be set to Use customer Clock Divider and appropriate value 5 should be set in the text box below 7 Open the Device Properties dialog Apply the settings highlighted Access ...

Page 19: ...he specifications and information herein are subject to change without notice FPGA EB 02007 1 1 19 The main differences between programming ICE40 UltraPlus devices and programming SPI Flash are 1 Board jumpers on J19 Vertical for CRAM programming and horizontal for SPI Flash programming 2 Board jumpers J28 1 2 Remove for CRAM programming and install for SPI Flash programming 3 The settings in the ...

Page 20: ...program the ICE devices directly depends on settings on jumper J19 8 2 Bluetooth This board features a Bluetooth module U30 to enable wireless communication with external devices like smart phones which is very useful while need to run some APPs on smart phone in demos This Bluetooth provide UART channel to communicate with ICE40 devices on board The operating range of the BLE module is up to 100 ...

Page 21: ...eviations are listed on the table below Abbreviation Standards Publication Organization and Date MIPI MIPI Alliance Mobile Industry Processor Interface CSI2 MIPI Alliance Camera Serial Interface For more information on the specifications that are applied in this document contact the responsible standards groups listed on the table below Standards Group Web URL MIPI Alliance http www mipi org Latti...

Page 22: ...mera FPGA Sheet 5 Display Sheet 7 Microphones Amplifier Sheet 8 Sensors RGB Sheet 9 Camera Sheet 10 SPI MUX Sheet 6 FTDI Sheet 11 AP Conn Sheet 6 SPI Flash Sheet 6 Switches Sheet 6 BLE Module Sheet 6 Common Components Sheet 13 Battery Sheet 14 Power Supplies Sheet 12 All pages Rev C Changed Gryroscope i2c address by grounding U36 27 Inserted 2 more pins to iCEA control J25 header pin 7 8 Added 4 r...

Page 23: ...CRSTb 3 4 5 6 10 11 13 I2S_SD_mic7 3 8 Title Size Document Number Rev Date Sheet of D iCE40UP5K FPGA A Display B 2 14 Friday November 03 2017 Title Size Document Number Rev Date Sheet of D iCE40UP5K FPGA A Display B 2 14 Friday November 03 2017 Title Size Document Number Rev Date Sheet of D iCE40UP5K FPGA A Display B 2 14 Friday November 03 2017 C13 0 1u C3 1u 30 R36 R0201 5 R178 1 C8 0 1u R2 2k2 ...

Page 24: ...0UP5K FPGA B Audio B 3 14 Friday November 03 2017 C102 10n D11 GREEN 2 1 C109 0 1u R185 1 TP53 TP55 TP33 C105 0 1u R147 0 TP36 J25 iCEA Control 1 3 5 7 9 2 4 6 8 10 11 12 R148 0 R169 0 J30 CON24A DNL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 R150 0 DNI C35 1u C78 0 1u C107 1u R84 100 TP57 TP32 C108 10n Bank2 Bank1 Bank0 iCEUP5K WLCSP30 iCE5UP5K WLCSP30 U2 IOB_0A E5 IOB_2A D5 I...

Page 25: ... Date Sheet of D iCE40UP5K FPGA C Sensor B 4 14 Friday November 03 2017 Title Size Document Number Rev Date Sheet of D iCE40UP5K FPGA C Sensor B 4 14 Friday November 03 2017 D12 GREEN 2 1 TP60 R205 0 C97 1u TP63 TP39 J26 iCEA Control 2 4 6 8 10 1 3 5 7 9 TP42 R207 0 DNI C112 1u C114 0 1u TP62 R85 100 C110 0 1u C121 0 1u TP38 C81 0 1u R192 1 TP59 R190 1 R47 0 C116 1u TP64 TP40 C117 10n R206 0 R154 ...

Page 26: ...cument Number Rev Date Sheet of D iCE40UP5K FPGA D Camera B 5 14 Friday November 03 2017 Title Size Document Number Rev Date Sheet of D iCE40UP5K FPGA D Camera B 5 14 Friday November 03 2017 Title Size Document Number Rev Date Sheet of D iCE40UP5K FPGA D Camera B 5 14 Friday November 03 2017 D14 GREEN 2 1 R32 0 C120 0 1u C133 0 1u C118 1u TP69 J27 iCEA Control 2 4 6 8 10 1 3 5 7 9 R100 100 R0201 D...

Page 27: ...mponents SPI B 6 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Common Components SPI B 6 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Common Components SPI B 6 14 Thursday November 02 2017 SW9B SW_SPST_6 2 11 TP77 R4 10k R7 10k J18 BLE PROG SEL 1 2 3 TP88 SW9C SW_SPST_6 3 10 R76 0 SW5B 2 3 TP78 TP89 M25P80 U37 SDI 5 SCK 6 WP 3 CS 1 SDO 2...

Page 28: ...ze Document Number Rev Date Sheet of D Display Circuitry B 7 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Display Circuitry B 7 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Display Circuitry B 7 14 Thursday November 02 2017 C70 1uF 35V C1206 C67 1uF C0402 16V C71 1uF 16V C0402 R103 0 5 R109 0 DNI C68 1uF C0402 16V TP22 R113 0 DNI U11 TP...

Page 29: ...3 I2S_SCK_mic 3 8 PDM_SD_mic1_mic2_onboard 3 Title Size Document Number Rev Date Sheet of D Audio Components B 8 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Audio Components B 8 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Audio Components B 8 14 Thursday November 02 2017 R175 0 C53 1u C416 10u J34 CUI_sj 3524 SMT 1 sleeve 3 ring 4 tip...

Page 30: ...ARE_C4 4 13 SPARE_C5 4 13 SPARE_C3 4 13 SPARE_C2 4 13 Title Size Document Number Rev Date Sheet of D Sensors RGB Circuitry B 9 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Sensors RGB Circuitry B 9 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Sensors RGB Circuitry B 9 14 Thursday November 02 2017 C77 0 1u C50 10u R108 0 DNI R12 10k C73 ...

Page 31: ...ument Number Rev Date Sheet of D Camera Circuitry B 10 14 Friday November 03 2017 C169 0 1uF DNI C85 0 1u U16 Hirose FX12 40 Pos DNI CH0_DCK_P 1 CH0_DCK_N 2 GND 3 CH0_DATA0_P 4 CH0_DATA0_N 5 GND 6 CH0_DATA2_P 7 CH0_DATA2_N 8 GND 9 SN 10 SCLK 11 PWR_12V 12 SDA1 13 SCL1 14 GND 15 CH2_DATA0_P 16 CH2_DATA0_N 17 GND 18 CH2_DCK_P 19 CH2_DCK_N 20 PWR_12 0V 21 RESETN 22 PWR_5 0V 23 CH0_DATA1_P 24 CH0_DATA...

Page 32: ...2 2017 R25 0 C313 0 1u C37 33p C48 0 1u C30 4 7u C22 0 1u C47 0 1u Y1 12MHz R21 0 R23 470 5V D D ID G USB PWR J5 1 2 3 4 S2 5 S1 S3 S4 R20 1k R16 10 C23 33p U93 ESDR0502 PART_NUMBER ESDR0502NMUTBG Manufacturer ON Semi GND 1 NC2 2 NC3 3 D 4 D 5 VBUS 6 C21 10u R11 10k R26 0 C20 0 1u L3 600 ohm 500 mA R28 0 R27 0 L1 600 ohm 500 mA R18 12k 93LC56BT I OT U6 GND 2 VCC 6 DO 1 DI 3 CLK 4 CS 5 R166 10k C29...

Page 33: ...us Mobile Development Platform VSUPPLY VCC1V2 VCC1V8 VCC2V5 VCC3V3 VSUPPLY VCC3V3 VCC3V3HP VSUPPLY VSUPPLY LDO_CE_VDC 7 10 Title Size Document Number Rev Date Sheet of D Power Supplies B 12 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Power Supplies B 12 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Power Supplies B 12 14 Thursday Novemb...

Page 34: ...PARE_C0 shared with PMOD LED is default SPARE_C0 shared with PMOD LED is default Common Control Headers iCE40 UltraPlus Mobile Development Platform FPGA_C GPIO LED2 LED1 Common Spare Signals VCC3V3 VCC3V3 VCCIO2_iCE_C SPIVCCIO1_iCE_C VCC3V3 VCCIO2_iCE_C SPARE_A0 2 7 SPARE_A1 2 7 SPARE_A2 2 7 SPARE_D0 5 10 SPARE_D1 5 10 SPARE_D2 5 10 SPARE_C0 4 9 SPARE_C1 4 9 SPARE_C2 4 9 SPARE_C3 4 9 SPARE_C4 4 9 ...

Page 35: ...t pads for battery soldering USB DRGN5V USB5V VSUPPLY BT_3V7 BT_3V7 USB5V BT_3V7 BT_3V7 BT_3V7 Title Size Document Number Rev Date Sheet of D Battery Connector Charger B 14 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Battery Connector Charger B 14 14 Thursday November 02 2017 Title Size Document Number Rev Date Sheet of D Battery Connector Charger B 14 14 Thursday N...

Page 36: ...C11 C14 C35 C53 C54 C55 C57 C59 C61 C79 C80 C82 C84 C93 C97 C103 C107 C112 C116 C118 C123 C128 24 1u 885012105012 Wurth CAP CER 1UF 10V X5R 0402 4 C7 C73 C104 C113 C125 5 10u CL05A106MP5NUNC Samsung CAP CER 10UF 10V X5R 0402 5 C15 1 1uF C1005X5R1C105K050BC TDK CAP CER 1UF 16V 10 X5R 0402 6 C16 1 100n 885012205037 Wurth CAP CER 0 1UF 16V X7R 0402 7 C17 C19 C20 C22 C24 C25 C26 C28 C29 C32 C33 C36 C3...

Page 37: ...2105016 Wurth CAP CER 0 1UF 16V X5R 0402 25 C90 C95 2 4 7uF C1005X5R1A475K050BC TDK CAP CER 4 7UF 10V 10 X5R 0402 26 C168 C169 C170 3 0 1uF 885012105016 Wurth CAP CER 0 1UF 16V X5R 0402 27 C415 C416 2 10u CL10X106MP8NRNC Samsung CAP CER 10UF 10V X6S 0603 28 D1 D11 D12 D14 4 GREEN 150060GS75000 Wurth LED GREEN CLEAR 0603 SMD 29 D2 1 Green 150060GS75000 Wurth LED GREEN CLEAR 0603 SMD 30 D3 D4 2 PMEG...

Page 38: ...SJ 3524 SMT TR CUI Inc CONN AUDIO JACK 3 5MM STEREO SMD 51 L1 L2 L3 3 600 Ohm 500 mA MMZ1608R601A TDK FERRITE BEAD 600 OHM 0603 1LN 52 L4 1 22uH AIML 0805HC 220M T Abracon Corporation HIGH CURRENT CHIP IND 22 0UH 20 53 R1 R84 R85 R86 4 100 RC1005J101CS Samsung RES 100 OHM 1 16W 5 0402 54 R2 R49 R69 R70 4 2k2 RC1005J222CS Samsung RES 2 2K OHM 1 16W 5 0402 55 R3 1 10K ERJ 2RKF1002X Panasonic RES 10K...

Page 39: ... OHM JUMPER 1 10W 0603 70 R33 R36 R72 3 30 ERJ 1GEJ300C Panasonic RES 30 OHM 1 20W 5 0201 SMD 71 R34 R38 R39 R71 4 1K ERJ 1GEF1001C Panasonic RES SMD 1K OHM 1 1 20W 0201 72 R41 1 10k ERJ 2GEJ103X Panasonic RES SMD 10K OHM 5 1 10W 0402 73 R42 1 18 ERJ 2GEJ180X Panasonic RES SMD 18 OHM 5 1 10W 0402 74 R44 1 0 ERJ 2GE0R00X Panasonic RES SMD 0 0 OHM JUMPER 1 10W 0402 75 R45 R48 R67 R68 R75 R223 6 0 ER...

Page 40: ...D 0 0 OHM JUMPER 1 10W 0603 94 R112 R114 2 0 ERJ 3GEY0R00V Panasonic RES SMD 0 0 OHM JUMPER 1 10W 0603 95 R117 R118 R120 R121 R122 R123 R124 R125 R126 R127 R128 R129 R130 R131 14 0 ERJ 3GEY0R00V Panasonic RES SMD 0 0 OHM JUMPER 1 10W 0603 96 R119 1 10k ERJ 3EKF1002V Panasonic RES SMD 10K OHM 1 1 10W 0603 97 R178 R179 R180 R181 R182 R183 R184 R185 R186 R187 R188 R189 R190 R191 R192 R193 R194 R195 R...

Page 41: ...32HL FTDI IC USB HS DUAL UART FIFO 64 LQFP 111 U10 1 AP7312 1218W6 7 AP7312 1218W6 7 Diodes Inc IC REG LDO 1 2V 1 8V 0 15A SOT26 112 U11 1 TPS61061 TPS61061DRBR TI IC LED DRIVER WHITE BCKLGT 8SON 113 U12 U19 2 INMP441 INMP441ACEZ Invensense Omnidirectional Microphone with bottom port and I2S digital port 114 U13 1 MIC5320 MIC5320 PGYMT TR Micrel Inc IC REG LDO 3V 1 8V 0 15A 6TMLF 115 U14 1 ASFLMB ...

Page 42: ...TVS DIODE 5 5VWM 6UDFN 130 U94 U95 2 MP34DB01 MP34DB01 STMicroelectr onics 20Hz 20kHz Digital PDM Microphone MEMS Silicon 1 8V Omnidirectional 26dB 3dB 94dB SPL Solder Pads 131 VCC_P VCC_N 2 TP_S_40_63 Square test point 40mil inner diameter 63mil outer diameter 132 Y1 1 12MHz ABM3 12 000MHZ B2 T Abracon Corp CRYSTAL 12MHZ 18PF SMD 133 iCE40UP Mobile Development Platform Board PCB 1 305 PD 16 0605 ...

Page 43: ...evice UI Added Table 7 2 iCE40 UltraPlus Device Selection Summary Corrected step 1 J19 setting changed to vertically in Programming the iCE40 Devices Configuration Memory CRAM section Updated Programming the iCE40 Devices Configuration Memory CRAM section Corrected step 1 J19 setting changed to horizontally Corrected step 7 figure reference for SPI Flash Options Indicated operating range of BLE mo...

Page 44: ...7th Floor 111 SW 5th Avenue Portland OR 97204 USA T 503 268 8000 www latticesemi com ...

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