HTCA-E400 User Manual
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The HMB-E200 compute sled is powered by 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake),
and provides front access I/O including 4x storage bays, 1x PCIe, 1x OCP NIC 3.0 slot, 1x mini-DP for VGA
port, 1x LOM and 1x USB 3.0 ports. The FHHL PCIe by 16 expansion slots, HL for 2U heatsink and 3/4L for
1U heatsink, can support a GPU or FPGA card, in addition to an OCP NIC 3.0 slot to plug in OCP 3.0 NIC
modules. This compute sled is compatible with HTCA-E400 series network appliances.
Key Features:
⚫
Support 3
rd
Gen Intel® Xeon® Scalable Processor (codenamed IceLake-SP)
⚫
Front Access I/O: 4x Storage bays, 1x PCIe, 1x OCP NIC 3.0 slot, 1x mini-DP for VGA Port, 1x LOM Port,
1x USB 3.0 Port
⚫
Support FH3/4L double width or single width PCIe Card
⚫
Support OCP NIC 3.0 Modules
⚫
Compatible with HTCA-E400 Series
Your package contains the following items:
1x HMB-E200 2U x86 Compute Sled
1x CPU Heat sink (in separate box)
1x Screw Pack
SKU No.
Description
HMB-E200A
2U Compute Sled for HTCA-E400
Model No.
Description
NIC Module
BCM957508-N2100G, N2100G 2x100G OCP NIC 3.0 Module
TPM Module
IAC-TPM04A, TPM 2.0 Module
Heat Sink
2U Heat Sink (up to 270W)
