HTCA-E400 User Manual
23
Item
Description
Processor
Please avoid touching the gold fingers or
package lands of the processor even if you are
wearing ESD gloves.
Heat Sink
If a TIM (Thermal Interface Material) protective
film is already attached to the base of the heat
sink, remove it before you mount the processor
on it.
When holding the heatsink, please grip it along
the axis of its fins with your thumb and your
index finger.
Processor
Carrier
This is packed along with the processor. Before
performing any assembly involving this part,
please locate
PIN1
on one of the corners, an
important indicator used to align this carrier
with the processor and the bolster plate
correctly.
Socket
Cover
This cover is used to protect the package land
surface of the processor from contamination. To
remove it from the processor, grasp the holding
features with your thumb and your index finger
while pulling the cover off vertically.
Bolster
Plate
A robust bolster plate is used to assist in PHM
alignment for installation, while effectively
helping eliminate PCB bowing during
compression. Please locate the
Cutout
on one
of the four corners before starting PHM
installation.
Axis
Align the
golden
fingers to
the PCIe
socket on
the
motherb
oard
carefully
while
inserting
this
module.
